Ultra-Thin Laminated Glass Cutting with Laser Cooling
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Solution Overview
Problem
Cutting ultra-thin glass layers in laminated compounds poses challenges due to rough cutting edges and microcracks from mechanical methods, and requires separate steps for cutting the glass and polymeric layers using laser processes.
Innovation Solution
A method involving a superficial scratch on the glass layer, followed by simultaneous laser cutting and cooling to create smooth edges without additional mechanical action, allowing for one-step cutting of both the glass and polymeric layers using synchronized laser beams and cooling processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mechanical glass cutting methods are used, then the cutting process is simple and fast, but the cutting edges become rough with microcracks and damage
Solution Approach 1:
The patent replaces mechanical glass cutting methods with a laser-based process. A laser beam is used to heat and cut the glass layer along a cutting line, eliminating the need for mechanical contact. This substitution of mechanical energy with optical/thermal energy resolves the contradiction by providing both high cutting speed and smooth, damage-free cutting edges.
2Manufacturing precision
If laser cutting is used for the glass layer, then smooth cutting edges are achieved, but the polymeric layer requires a separate subsequent cutting step
Solution Approach 1:
The patent combines the cutting of the glass layer and the polymeric layer into a single integrated process. The laser beam is used to cut both layers simultaneously along the same cutting line, merging two separate operations into one. This resolves the contradiction by maintaining high cutting edge quality for the glass while eliminating the need for a separate mechanical cutting step for the polymeric layer, thus reducing overall process complexity.
3Ease of manufacture
If the polymeric layer is cut before glass layer, then the glass can be cut more easily, but the cycle time increases due to sequential processing
Solution Approach 1:
The patent merges the cutting operations for both layers into a simultaneous single-step process. The laser beam cuts through both the glass layer and the polymeric layer at the same time along the same cutting line, eliminating sequential processing. This resolves the contradiction by maintaining ease of glass cutting while dramatically reducing cycle time through parallel processing of both layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method produces smooth cutting edges with minimal glass damage, eliminating the need for subsequent mechanical processing and enabling higher cycle times for industrial production by integrating the cutting process into a single step.
Implementation Method 1
The glass layer is irradiated with a first laser beam along a desired cutting line starting from the scratch
Implementation Method 2
The subsequent irradiation of the cutting line with a laser beam leads to a heating of the glass layer along the cutting line. The subsequent cooling generates thermal stresses, which independently lead to the breakage of the glass layer along the cutting line.
Implementation Method 3
The subsequent cooling generates thermal stresses, which independently lead to the breakage of the glass layer along the cutting line
Implementation Method 4
The polymeric layer is cut along the same cutting line by moving a second laser beam
Data Source
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AI summary
The present invention relates to a method for cutting a laminate (10) composed of at least one glass layer (1) having a thickness of less than or equal to 0.3 mm and at least one polymer layer (5), comprising at least: a) generating a scratch (2) on the surface of a first surface (I) of the glass layer (1), wherein the scratch (2), starting from a lateral edge, extends along a cutting line (L); b) moving a first laser beam (3) starting from the scratch (2) across the first surface (I) along the cutting line (L); c) cooling the glass layer (1) along the cutting line (L), wherein the glass layer (1) breaks along the cutting line (L); wherein the polymer layer (5) is severed by moving a second laser beam (6) along the cutting line (L).