Ultra-Thin Liquid Crystal Panel Manufacturing via Substrate Bonding
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Solution Overview
Problem
The existing manufacturing processes for thin film transistor liquid crystal displays (TFT-LCDs) face challenges in producing ultra-thin glass substrates without bending or breaking, leading to defects and increased costs due to the need for thinning processes that can result in environmental pollution.
Innovation Solution
A method involving the bonding of two ultra-thin glass substrates to form a mother substrate, followed by the formation of array and color filter patterns, alignment layers, and separation to create an ultra-thin liquid crystal panel without subsequent thinning, using a high-temperature thermally curable adhesive and non-contact processes to prevent damage and distortion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If glass substrate thickness is reduced to make liquid crystal panels thinner, then panel thickness and weight are reduced, but substrate bending and cracking risk increase
Solution Approach 1:
The patent applies preliminary action by bonding two ultra-thin glass substrates together before the manufacturing process to create a mother substrate. This preliminary bonding prevents bending and cracking during subsequent processing steps, while still allowing the final product to be ultra-thin after separation.
Solution Approach 2:
The patent uses an intermediary approach by introducing a mother substrate as a temporary carrier. The two ultra-thin glass substrates are bonded to this mother substrate during manufacturing, providing mechanical support, and then separated afterward to achieve the ultra-thin final product.
2Length of moving object
If conventional thinning processes are applied to reduce cell thickness, then liquid crystal panel thickness is reduced, but product defects and environmental pollution increase
Solution Approach 1:
The patent performs the thinning action preliminarily by selecting ultra-thin glass substrates (0.1-0.5mm) from the beginning, rather than starting with thick substrates and thinning them later. This eliminates the need for hydrofluoric acid etching or mechanical polishing that cause surface defects.
Solution Approach 2:
The patent converts the potential harm of using ultra-thin substrates (which are more fragile) into a benefit by bonding two of them together to form a mother substrate. This provides the mechanical strength needed for manufacturing while maintaining the ultra-thin characteristic in the final product.
3Length of moving object
If conventional thinning processes are applied to reduce cell thickness, then liquid crystal panel thickness is reduced, but manufacturing cost and environmental impact increase
Solution Approach 1:
The patent extracts and eliminates the harmful thinning process steps (hydrofluoric acid etching, mechanical polishing) from the manufacturing flow. By using ultra-thin substrates from the start and bonding them to form a mother substrate, the need for these costly and environmentally harmful processes is removed.
Solution Approach 2:
The patent applies self-service by using the two ultra-thin glass substrates themselves to provide the mechanical strength needed for manufacturing. By bonding them together to form a mother substrate, they self-support the structure during processing, eliminating the need for additional thickening or support structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of ultra-thin TFT-LCDs with a thickness of less than 0.5 mm, reducing manufacturing costs, minimizing environmental impact, and avoiding defects such as scratches and substrate breakage, while maintaining the performance and quality of the liquid crystal panel.
Implementation Method 1
using a high-temperature thermally curable adhesive
Data Source
AI summary
A method for manufacturing a liquid crystal panel is provided. The method comprises bonding a first substrate with a second substrate so as to form a mother substrate; forming an array pattern on a first substrate side of the mother substrate, the first substrate side being away from the second substrate; separating the first substrate and the second substrate of the mother substrate; and bonding the separated first substrate and the second substrate so that the array pattern is located between the first and second substrates.