Ultra-Thin LED Electrode Assembly for Defect-Tolerant AR/VR Displays
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Solution Overview
Problem
Conventional AR and VR displays using micro-LEDs suffer from low resolving power due to display defects such as dark spots caused by process defects, vacancies, and misalignment errors during transfer, which are exacerbated by the difficulty in manufacturing high-resolution displays with micro- and nano-LEDs on miniaturized electrodes.
Innovation Solution
A high-resolution ultra-thin LED display is developed, featuring an ultra-thin LED electrode assembly with multiple ultra-thin LED elements per subpixel, arranged in a manner that minimizes misalignment and vacancies, utilizing a manufacturing process that includes inkjet printing and laser-assisted transfer methods to form pixel units on lower electrodes, with insulating layers and upper electrodes for improved alignment and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If micro-LEDs with size of 1 μm to 5 μm are used to manufacture high-resolution displays, then resolving power is improved, but display defects occur due to process defects, vacancies, and misalignment errors during transfer
Solution Approach 1:
Each pixel unit is divided into multiple subpixels, and each subpixel includes multiple ultra-thin LED elements. This segmentation allows the display to tolerate individual element failures while maintaining overall image quality, thereby reducing the impact of vacancies and misalignment errors on display reliability
Solution Approach 2:
The patent implements redundant LED elements within each subpixel to compensate for potential process defects and transfer errors. By having multiple elements per subpixel, the system预先 buffers against the harmful effects of vacancies and misalignment, ensuring display reliability even when some elements fail
2Measurement precision
If micro-LEDs are individually disposed on miniaturized electrodes using pick and place technology, then high-resolution display is achieved, but manufacturing complexity and cost increase significantly
Solution Approach 1:
Multiple ultra-thin LED elements are transferred together as a group to form subpixels, and multiple subpixels are combined to form pixel units. This merging approach reduces the number of individual transfer operations required compared to placing each micro-LED separately, thereby simplifying the manufacturing process while maintaining high resolution
Solution Approach 2:
The patent uses transfer printing technology to replicate patterns of ultra-thin LED elements from a donor substrate to the display substrate. This copying method enables high-resolution patterning without requiring individual manual placement of each LED, significantly reducing manufacturing complexity
3Measurement precision
If ultra-thin LED elements are used to reduce pixel size for high resolution, then resolving power is improved, but light extraction area is reduced affecting brightness
Solution Approach 1:
Multiple ultra-thin LED elements are combined within each subpixel to achieve the required brightness level. By merging the light output of multiple small elements, the system compensates for the reduced light extraction area of individual ultra-thin LEDs while maintaining the high resolution enabled by their small size
Solution Approach 2:
The patent transitions from a single-layer LED structure to a multi-layer electrode assembly structure with lower electrodes, insulating layers, and upper electrodes. This dimensional change allows for optimized light extraction paths and enhanced brightness through the stacked configuration, compensating for the small footprint of ultra-thin LED elements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides high-resolution displays with resolving power up to 3,000 pixels per inch, reducing display defects and enhancing brightness, response speed, and luminous efficiency by optimizing electron-hole recombination and light extraction area.
Implementation Method 1
utilizing a manufacturing process that includes inkjet printing and laser-assisted transfer methods to form pixel units on lower electrodes
Implementation Method 2
utilizing a manufacturing process that includes inkjet printing and laser-assisted transfer methods to form pixel units on lower electrodes
Implementation Method 3
high-resolution ultra-thin LED display which secures high resolving power by applying ultra-thin LEDs to LED elements of a display
Data Source
AI summary
The present invention relates to a high-resolution ultra-thin light-emitting diode (LED) display and a manufacturing method thereof and relates to a display having very high resolving power and optical properties by introducing ultra-thin LED elements, and a manufacturing method capable of manufacturing the same with a very low defect rate.