Ultra-Thin LED Display Structure for High-Resolution Electrode Layout
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Solution Overview
Problem
Existing micro- and nano-LED displays face challenges in manufacturing high-resolution displays due to high unit costs, low productivity, and inefficient electrode arrangement, with nanorod-type LEDs having narrow emission areas and low efficiency due to surface defects and electron-hole recombination issues.
Innovation Solution
A full-color LED display using ultra-thin LED elements with a specific geometric structure and alignment-inducing layers, allowing for easy electrode arrangement and minimizing efficiency loss through optimized electron-hole recombination, is developed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If nanorod-type LEDs are used with top-down or bottom-up manufacturing methods, then LED elements can be produced, but emission efficiency is significantly reduced due to narrow emission area and surface defects
Solution Approach 1:
The patent changes the geometric parameters of the LED structure from conventional nanorods to ultra-thin plate-shaped structures with thickness of 1-10 μm and lateral dimensions of 10-100 μm. This parameter change increases the emission area while maintaining manufacturability through established semiconductor processing techniques.
Solution Approach 2:
The patent employs composite material structures including p-type and n-type semiconductor layers stacked in specific configurations, with each layer having optimized thickness and composition. This composite approach enables efficient electron-hole recombination while maintaining structural integrity and ease of manufacture through standard semiconductor layering techniques.
2Ease of operation
If electrodes are disposed spaced apart in horizontal direction for nanorod-type LEDs, then current can be applied to p-type and n-type layers, but electrode arrangement for addressing becomes difficult
Solution Approach 1:
The patent transitions from horizontal electrode spacing to vertical electrode stacking, with first and second electrodes positioned above and below the ultra-thin LED elements respectively. This dimensional change enables straightforward addressing schemes while achieving high display resolution through the thin-profile structure.
Solution Approach 2:
The patent segments the electrode structure into distinct first and second electrodes positioned on opposite sides of the LED elements, with each electrode independently controllable. This segmentation enables precise addressing of individual pixels while maintaining high resolution through the organized vertical arrangement.
3Reliability
If micro-LEDs are individually disposed on miniaturized electrodes using pick and place technique, then high performance characteristics can be achieved, but unit cost is high and productivity is low
Solution Approach 1:
The patent performs preliminary actions by pre-forming the ultra-thin LED elements with both electrodes and contact structures integrated during the semiconductor manufacturing process itself, rather than adding them separately later. This preliminary integration enables high-performance displays to be manufactured with high productivity through standard batch processing techniques.
Solution Approach 2:
The patent merges the LED active region with the electrode structures into a single integrated semiconductor device. The p-type and n-type layers serve both as the light-emitting structure and as the electrode contact points, eliminating the need for separate pick-and-place operations and enabling high-throughput manufacturing.
4Reliability
If nanorod-type LEDs are used with large side surface area from etching, then manufacturing is feasible, but emission efficiency degrades due to surface defects
Solution Approach 1:
The patent changes the geometric parameters from high aspect-ratio nanorods to ultra-thin plate structures with controlled thickness of 1-10 μm and optimized lateral dimensions of 10-100 μm. This parameter change reduces the relative surface area while maintaining sufficient emission area, thereby minimizing the impact of surface defects on overall emission efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-resolution displays with improved luminance and reduced defects, facilitating easier manufacturing and maintaining efficiency by balancing electron-hole recombination and minimizing surface defects.
Implementation Method 1
the alignment-inducing layer may be a magnetic layer, a charge layer, or a bonding layer
Implementation Method 2
the alignment-inducing layer may be a magnetic layer, a charge layer, or a bonding layer
Implementation Method 3
the alignment-inducing layer may be a magnetic layer, a charge layer, or a bonding layer
Implementation Method 4
a light-emitting element according to one embodiment may be an ultra-thin light-emitting diode element
Data Source
AI summary
The present disclosure relates to a full-color light-emitting diode (LED) display, and more particularly, to a full-color LED display using an ultra-thin LED clement and a manufacturing method thereof.