Ultra-thin micro-electrostatic module and production method thereof
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing micro-electrostatic modules occupy space in the thickness direction, leading to efficiency and dust holding capacity losses in installations with limited space.
Innovation Solution
An ultra-thin micro-electrostatic module design featuring a micro-electrostatic module core with fixing grooves and frames, fixed by fixing components, and a production method involving thermal cutting to reduce thickness and enhance structural integrity and dust holding capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a traditional micro-electrostatic module with outer frame is used, then structural support is provided, but the thickness direction space is occupied, reducing purification efficiency and dust holding capacity
Solution Approach 1:
The patent removes the traditional outer frame structure from the micro-electrostatic module, extracting only the essential functional components (electrostatic module core and fixing components) to eliminate unnecessary thickness while maintaining structural support and electrostatic functionality
Solution Approach 2:
The patent transitions from a three-dimensional framed structure to a two-dimensional planar arrangement by eliminating the outer frame, allowing the electrostatic module core to be directly supported by fixing components on the frame body, thereby reducing thickness while preserving structural integrity
2Length of moving object
If a traditional micro-electrostatic module with outer frame is used, then structural support is provided, but the thickness direction space is occupied, reducing dust holding capacity
Solution Approach 1:
The patent removes the outer frame structure that was consuming thickness direction space, extracting only the essential fixing components needed to support the electrostatic module core, thereby maximizing the space available for dust collection without compromising structural support
Solution Approach 2:
By eliminating the outer frame and adopting a planar fixing component arrangement, the patent converts vertical space consumption into horizontal space utilization, allowing the electrostatic module core to extend further in the dust collection direction while maintaining adequate structural support
Data Source
AI summary
The present application provides an ultra-thin micro-electrostatic module and a production method. The ultra-thin micro-electrostatic module includes a micro-electrostatic module core, wherein the micro-electrostatic module core comprises a plurality of air channels for air circulation and is provided with a fixing groove; a frame body comprising a plurality of frames arranged corresponding to the micro-electrostatic module core, wherein the micro-electrostatic module core is accommodated in the frame body; and a fixing component, wherein the fixing component is embedded in the fixing groove, and is connected with the frame body and the micro-electrostatic module core to fix the micro-electrostatic module core. The ultra-thin micro-electrostatic module in the present application solves the technical problem that the outer frame of the micro-electrostatic module occupies the size in the thickness direction, resulting in the loss of purification efficiency and dust holding capacity.