Ultra-Thin Electronic Component Packaging Without Photolithography
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Solution Overview
Problem
Conventional embedded packaging of electronic components is limited by excessive thickness, high cost due to photolithography processes, and non-uniform re-distribution layers, making it difficult to reduce the size of power modules effectively.
Innovation Solution
A packaging process involving back grinding to achieve ultra-thin thickness, eliminating the need for photolithography by forming contact pads through drilling and grinding, and using thermal release materials to manage thermal conduction and insulation layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional embedded package structure is used, then electronic components can be integrated into power module, but thickness exceeds 350 μm making it difficult to reduce space
Solution Approach 1:
The patent applies preliminary action by performing back grinding on the electronic component before packaging to pre-reduce its thickness. This preliminary thickness reduction enables the final packaged module to achieve ultra-thin profile (less than 350 μm) while maintaining manufacturing feasibility through standardized processes.
Solution Approach 2:
The patent changes the thickness parameter of the electronic component through back grinding process, reducing it from conventional thickness to ultra-thin thickness. This parameter change is then maintained throughout the packaging process, allowing the final module to achieve reduced space requirements while using standard embedded package structures.
2Adaptability or versatility
If photolithography process is used to form re-distribution layer, then conducting terminals become available in other locations, but process cost increases
Solution Approach 1:
The patent extracts the photolithography process from the manufacturing flow and replaces it with mechanical drilling and grinding processes. This extraction eliminates the need for expensive photolithography equipment and materials while achieving the same functional outcome of creating conductive pathways through the insulation layer to redistribute terminals.
Solution Approach 2:
The patent uses simple, inexpensive mechanical processes (drilling and grinding) instead of expensive photolithography. The consumable drilling bits and grinding elements are replaced, but the overall process cost is reduced by eliminating complex photolithography materials and equipment requirements.
3Manufacturing precision
If electrolytic copper plating process is used for re-distribution layer, then conducting terminals are formed, but thickness becomes non-uniform
Solution Approach 1:
The patent replaces the electrochemical copper plating process with purely mechanical processes (drilling and grinding). This substitution eliminates the non-uniform thickness problem inherent in electrolytic plating by using controlled mechanical removal of material, achieving uniform thickness through precision mechanical means rather than electrochemical deposition.
4Volume of moving object
If back grinding process is applied to reduce thickness, then ultra-thin thickness less than 50 µm is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The back grinding process is applied as a preliminary action before final packaging assembly. This timing allows for precise thickness control to be established early in the manufacturing process, and the ultra-thin component is then handled with care during subsequent packaging steps to maintain the achieved precision.
Solution Approach 2:
The grinding process applies localized precision removal of material from the back surface of the electronic component. By concentrating the precision requirement on the specific grinding operation rather than the entire manufacturing process, the patent achieves ultra-thin thickness control through a dedicated precision step followed by standard handling procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The process reduces the thickness of electronic components to less than 50 µm, lowers production costs, and ensures uniformity of contact pads, thereby minimizing space requirements and enhancing the compactness of power modules.
Implementation Method 1
A first thermal release material is formed on the first carrier. At least one electronic component and at least one thermal conduction structure are attached on the first thermal release material.
Data Source
Figure 1A~1D
Figure 1E~1H
Figure 1I~1L
AI summary
A packaging process of an electronic component (13) is provided. By the packaging process of the disclosure, the electronic component (13) is grinded by the back grinding process. Consequently, thickness of the electronic component (13) may be reduced to less than or equal to 50 µm. The packaging process may achieve ultra-thin thickness and reduce the space of the power module (1). Moreover, the packaging process forms the contact pads (193, 194, 195) with drilling process and grinding process without photolithography process. Consequently, the packaging process is advantageous because of lower cost and uniform thickness of the contact pads (193, 194, 195).