Ultra-Thin Sandwich Passive Component for Easier Surface Mounting
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Solution Overview
Problem
The miniaturization of passive components for high frequency applications, such as 5G spectrum frequencies, poses challenges in surface mounting due to increased difficulty in handling small components without compromising performance.
Innovation Solution
A method involving the formation of a component with a first and second substrate, where vias and conductive pathways are created, and the substrates are processed to reduce thickness, allowing for the creation of ultra-thin components with conductive pathways sandwiched between them, enabling reduced height without adverse effects on performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If miniaturization is applied to passive components for high frequency applications, then component size is reduced, but surface mounting difficulty increases
Solution Approach 1:
The patent transitions from reducing component footprint (2D dimension) to reducing component height (3D dimension). By creating ultra-thin components with heights less than 40 mils through substrate thinning and sandwich construction, the invention achieves miniaturization in the vertical dimension while maintaining standard footprint dimensions, thereby preserving ease of surface mounting.
Solution Approach 2:
The patent changes the thickness parameter of the substrate from conventional dimensions to ultra-thin dimensions (less than 40 mils). This parameter change enables high-frequency operation with improved RF performance while maintaining standard component footprints for existing surface mount technology compatibility.
2Length of moving object
If component thickness is reduced to achieve miniaturization, then component height decreases, but manufacturing complexity increases
Solution Approach 1:
The patent performs preliminary substrate thinning and via formation before final assembly. By pre-processing the substrates to the desired ultra-thin dimensions and pre-forming the conductive pathways and vias, the manufacturing complexity is managed in controlled stages rather than requiring complex post-assembly operations.
Solution Approach 2:
The patent divides the component into multiple segments including first substrate, second substrate, conductive pathways, and vias. This segmentation allows each element to be manufactured and processed independently at optimal thicknesses, then assembled into the final ultra-thin sandwich structure, simplifying the overall manufacturing process.
3Reliability
If substrate thickness is reduced to create ultra-thin components, then component performance at high frequencies improves, but structural integrity may be compromised
Solution Approach 1:
The patent employs composite construction with multiple substrate layers (first and second substrates) separated by dielectric material and connected through plated vias. This sandwich composite structure provides the mechanical strength of multiple layers while achieving ultra-thin overall dimensions, maintaining structural integrity despite reduced individual substrate thicknesses.
Solution Approach 2:
The patent nests conductive pathways and vias within the substrate structure, with conductive material plated inside vias and dielectric material nested between substrate layers. This nested configuration maximizes the use of space within the ultra-thin envelope while maintaining structural strength through distributed material placement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the creation of components with a thickness of less than 40 mils, improving RF performance by enabling higher frequency operation and reducing transmission line width, which enhances passband loss and allows more poles in smaller packages.
Implementation Method 1
plating the one or more vias
Data Source
AI summary
Components, methods of forming components, and methods of assembling components on an electronic device are provided. For example, a method of forming a component includes providing a first substrate having a first surface, a second surface opposite the first surface along a height direction, and an initial thickness from the first surface to the second surface along the height direction; forming one or more vias in the first substrate, each via extending from the first surface to the second surface of the first substrate; depositing one or more conductive pathways on the first surface of the first substrate; plating the one or more vias; disposing a second substrate on the first surface of the first substrate to form a component sandwich; processing the second surface of the first substrate to reduce a thickness of the component sandwich; and forming one or more contact pads on the first substrate.