Ultra-Thin Substrate Packaging With Temporary Carrier Support
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Solution Overview
Problem
Conventional semiconductor packages and manufacturing methods result in excessive costs, decreased reliability, and larger package sizes, which are inadequate for modern semiconductor devices.
Innovation Solution
A semiconductor device and manufacturing method utilizing an ultra-thin substrate structure with a carrier and adhesive layer, where components are mounted and encapsulated, and the carrier and adhesive layer are subsequently removed, enabling reduced size, increased reliability, and cost-effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packages are used, then manufacturing is simpler, but package size is too large and cost is excessive
Solution Approach 1:
The substrate is thinned to ultra-thin dimensions before component mounting and encapsulation. This preliminary substrate preparation enables the final package to achieve reduced size while the complex steps (mounting, encapsulation, carrier removal) are performed on the thin substrate to achieve compact final dimensions
2Reliability
If conventional semiconductor packages are used, then structural support is adequate, but cost is excessive and reliability is decreased
Solution Approach 1:
The substrate thickness parameter is changed to ultra-thin dimensions, fundamentally altering the mechanical and electrical characteristics of the package. This parameter change enables improved reliability through reduced parasitic effects and lower cost by using less material, while the temporary carrier provides structural support during manufacturing
Solution Approach 2:
A carrier is introduced as an intermediary structural element that provides mechanical support during the manufacturing process. The carrier enables handling and processing of the ultra-thin substrate without requiring the substrate itself to have high structural strength, thus allowing use of thinner, more reliable substrate material
3Volume of moving object
If ultra-thin substrate is used, then package size is reduced and reliability is enhanced, but manufacturing process becomes more complex
Solution Approach 1:
The substrate is thinned to ultra-thin dimensions before component mounting and encapsulation. This preliminary substrate preparation enables the final package to achieve reduced size while the complex steps (mounting, encapsulation, carrier removal) are performed on the thin substrate to achieve compact final dimensions
Data Source
AI summary
A semiconductor device and a method of manufacturing a semiconductor device. For example, various aspects of this disclosure provide a semiconductor device having an ultra-thin substrate, and a method of manufacturing a semiconductor device having an ultra-thin substrate. As a non-limiting example, a substrate structure comprising a carrier, an adhesive layer formed on the carrier, and an ultra-thin substrate formed on the adhesive layer may be received and/or formed, components may then be mounted to the ultra-thin substrate and encapsulated, and the carrier and adhesive layer may then be removed.