Ultrasonic Airflow Package for Slim Electronics Cooling
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Solution Overview
Problem
The challenge of effective heat management and dissipation in electronic devices, particularly in devices that require complex computations and generate significant heat, such as smartphones and data center servers, is critical for maintaining performance and efficiency.
Innovation Solution
An electronic device with an airflow generating package that includes a film structure with flaps operating at ultrasonic rates to produce airflow, which flows through a heat conductive component to dissipate heat, utilizing a base with air channels and protrusions to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional heat dissipation methods are used in slim electronic devices, then device thickness is reduced, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent replaces conventional mechanical fans or passive heat sinks with an ultrasonic vibration-based airflow generation system. The ultrasonic component vibrates at high frequency to generate acoustic radiation pressure that drives airflow through heat dissipation channels, eliminating the need for bulky mechanical cooling systems while maintaining effective heat removal in slim device profiles.
Solution Approach 2:
The patent changes the operating parameters by using ultrasonic frequency vibrations (typically 20-100 kHz) to generate airflow. This high-frequency oscillation creates acoustic streaming effects that produce continuous unidirectional airflow without mechanical moving parts, enabling efficient heat dissipation in thin form factors where traditional convection or conduction methods would require excessive space.
2Productivity
If complex computations are performed to improve device functionality, then computational performance is improved, but heat generation increases
Solution Approach 1:
The patent introduces an ultrasonic airflow generation system as an intermediary cooling mechanism between the operational component and the external environment. The ultrasonic component converts electrical energy to mechanical vibrations that generate airflow, which then acts as a heat transfer medium to carry away heat from the operational component, effectively decoupling computational performance from thermal management constraints.
Solution Approach 2:
The ultrasonic component operates with periodic high-frequency vibrations to generate pulsating airflow that continuously removes heat. This periodic acoustic oscillation creates alternating compression and rarefaction waves that drive air molecules through the heat dissipation channels, providing sustained cooling capacity that matches the intermittent heat generation from computational workloads.
3Temperature
If traditional airflow generation methods are used, then heat dissipation is achieved, but device complexity and power consumption increase
Solution Approach 1:
The patent extracts the airflow generation function from complex mechanical systems and implements it through ultrasonic vibration alone. By removing fans, motors, and associated control mechanisms, the design achieves heat dissipation through a single ultrasonic component that generates acoustic radiation pressure to drive airflow, significantly reducing device complexity while maintaining cooling effectiveness.
Solution Approach 2:
The ultrasonic component serves multiple functions simultaneously: it generates the driving force for airflow through its own vibrations, creates the acoustic streaming effect for unidirectional flow, and requires no external mechanical drive system. The system is self-contained, with the ultrasonic transducer converting electrical energy directly into the mechanical vibrations needed for airflow generation, eliminating the need for separate motors or power transmission mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The airflow generating package effectively dissipates heat generated by operational components, improving device performance and efficiency by managing thermal buildup.
Implementation Method 1
The film structure includes a flap pair, and the flap pair operates at an ultrasonic rate to produce an airflow
Implementation Method 2
The heat conductive component is configured to conduct the heat generated by the operational component
Implementation Method 3
The airflow generated by the airflow generating package flows through the heat conductive component, so as to dissipate the heat generated from the operational component through the heat conductive component
Data Source
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AI summary
An electronic device (DV) includes an operational component (110), a heat conductive component (120) and an airflow generating package (PG). The heat conductive component (120) is configured to conduct a heat generated by the operational component (110), wherein the operational component (110) is disposed on the heat conductive component (120). The airflow generating package (PG) is disposed by an edge of the electronic device (DV). The airflow generating package (PG) includes a film structure (FS) including a flap pair (FP). The flap pair (FP) operates at an ultrasonic rate to produce an airflow. The heat conductive component (120) extends toward the airflow generating package (PG), such that the airflow generated by the airflow generating package (PG) flows through the heat conductive component (120), so as to dissipate the heat generated from the operational component (110) through the heat conductive component (120).