Ultrasonic Element Array Composite Insulating Film
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Solution Overview
Problem
Existing ultrasonic element arrays face challenges with moisture and voltage resistance, particularly at wire crossings, where thin inorganic insulating films can lead to current leakage and compromised vibration characteristics.
Innovation Solution
The use of an insulating film comprising both inorganic and organic materials, where the inorganic film provides moisture resistance and the organic film offers electrical resistance, is implemented between wires to prevent short-circuits and enhance moisture barrier properties, while also optimizing wire placement to increase piezoelectric element density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If thin inorganic insulating films are used between crossing wires, then the device complexity is reduced, but moisture and voltage resistance deteriorate leading to current leakage
Solution Approach 1:
The patent applies composite materials by combining inorganic and organic insulating films in a layered structure. The inorganic film provides moisture resistance while the organic film provides electrical resistance, creating a composite insulating system that addresses both reliability requirements simultaneously.
Solution Approach 2:
The patent applies local quality by providing different types of insulating films at different locations: inorganic films are applied where moisture resistance is critical (covering piezoelectric elements and at wire crossings), while organic films are applied where electrical insulation is critical (between crossing wires). This localized differentiation optimizes both moisture and voltage resistance.
2Length of stationary object
If terminals are provided on two opposed sides only, then the width of the array is reduced, but wire crossing locations become necessary leading to current leakage
Solution Approach 1:
The patent uses composite insulating films (inorganic + organic layers) at wire crossing locations to provide both moisture barrier and electrical insulation properties, enabling the compact two-sided terminal configuration to maintain reliability despite the necessary wire crossings.
Solution Approach 2:
The patent applies enhanced insulating film structures specifically at wire crossing locations where terminals are provided on opposed sides, providing localized moisture and electrical protection at the critical crossing points while maintaining the overall compact array width.
3Ease of manufacture
If inorganic insulating films are made thinner to reduce complexity, then manufacturing is easier, but current leakage between wires increases
Solution Approach 1:
The patent combines thin inorganic films (easy to deposit) with organic films (provide electrical resistance) to create a composite insulating structure that maintains ease of manufacture while preventing current leakage through the synergistic properties of the layered material system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves the ultrasonic element array's resistance to both moisture and voltage, maintaining vibration characteristics and increasing productivity in manufacturing by reducing the risk of short-circuits and allowing efficient ultrasonic wave output.
Implementation Method 1
Piezoelectric materials that deform by application of voltages are widely known. When a voltage is applied between the electrodes, the piezoelectric material deforms. Ultrasonic waves may be generated using the nature of the piezoelectric material.
Implementation Method 2
when the piezoelectric material receives the ultrasonic waves and vibrates, the ultrasonic waves may be detected by detection of fluctuations of the potential difference between the electrodes.
Data Source
AI summary
An ultrasonic element array includes a first piezoelectric element, a second piezoelectric element, a third piezoelectric element, and a fourth piezoelectric element each having a piezoelectric material sandwiched by a first electrode and a second electrode, a first wire connecting the second electrode of the first piezoelectric element and the second electrode of the second piezoelectric element, a second wire connecting the second electrode of the third piezoelectric element and the second electrode of the fourth piezoelectric element, a third wire connecting to the second wire over the first wire, and an insulating film located between the first wire and the third wire, wherein the insulating film has an inorganic insulating film made of an inorganic material and an organic insulating film made of an organic material, and the inorganic insulating film covers the piezoelectric elements.