Ultrasonic Transducer Array Wire Routing for Compact Sensor Design
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Solution Overview
Problem
Existing ultrasonic sensors face challenges in downsizing due to the complex arrangement of drive signal wires and common wires, which leads to increased size and difficulty in two-dimensional wire arrangement, causing fluctuations in receiving element characteristics and potential short circuits.
Innovation Solution
The ultrasonic device employs a grid pattern of nine ultrasonic array units with drive bypass wires, a first and second common bypass wire, and a third common bypass wire to efficiently arrange wires between and within ultrasonic array units, allowing for downsized design without wire crossing, thus preventing short circuits and simplifying manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If drive signal wires and common wires are sterically arranged by wire bonding, then individual receiving elements can independently receive ultrasonic waves, but the size of the ultrasonic sensor is increased
Solution Approach 1:
The patent transitions from three-dimensional wire bonding arrangement to a two-dimensional planar arrangement on a substrate. Multiple wires for each receiving element are arranged side-by-side in the same plane between adjacent receiving elements, eliminating the need for vertical stacking and reducing overall sensor size while maintaining independent receiving capability.
Solution Approach 2:
The patent combines multiple wires (drive signal wires and common wires) for each receiving element into a compact bundled arrangement that occupies minimal space. By merging these wires into integrated cable assemblies that can be routed efficiently across the substrate, the patent reduces the total area required for wire management.
2Device complexity
If spaces between receiving elements are increased to place multiple wires, then wires can be arranged, but characteristics of receiving elements fluctuate
Solution Approach 1:
The patent places exactly the necessary number of wires between receiving elements without excessive spacing. By carefully controlling the wire bundle size and routing density, the patent provides sufficient space for multiple wires while maintaining optimal spacing between receiving elements, thus preserving their acoustic characteristics.
3Manufacturing precision
If wires are placed without increasing spaces between receiving elements, then receiving element characteristics are maintained, but wires become entangled and cannot be two-dimensionally arranged
Solution Approach 1:
The patent successfully arranges multiple wires in two dimensions by utilizing the full planar space between receiving elements. Wires are routed in organized parallel paths or bundled configurations that fit within the available lateral space, transforming the wire arrangement from a three-dimensional tangled mass to a structured two-dimensional layout.
Solution Approach 2:
The patent segments the wire routing into distinct pathways for different wire types (drive signal wires versus common wires). By separating and organizing wires into functional groups with dedicated routing channels, the patent prevents entanglement while maintaining compact spacing between receiving elements.
4Area of stationary object
If drive signal wires and common wires are crossed for wiring, then space is saved, but insulation becomes necessary to prevent short circuits and manufacture becomes complex
Solution Approach 1:
The patent segments wires into functionally grouped bundles (drive signal wires together, common wires together) and routes these bundles separately without crossing. This segmentation eliminates the need for complex insulation schemes required by crossed wiring, simplifying manufacturing while saving space through efficient parallel routing.
Solution Approach 2:
Instead of crossing wires to save space (conventional approach), the patent inverts the strategy by routing wires in parallel non-crossing paths. This inverted approach achieves space efficiency through compact parallel arrangement rather than through crossing, thereby eliminating insulation complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the ultrasonic device to maintain consistent ultrasonic transducer spacing, reduce crosstalk, and improve vibration characteristics, resulting in enhanced performance and easier manufacturing by allowing for non-crossing wire arrangements.
Implementation Method 1
ultrasonic transducers that transmit and receive ultrasonic waves
Implementation Method 2
transmitting and receiving elements that transmit and receive ultrasonic waves
Data Source
AI summary
An ultrasonic device includes nine ultrasonic array units arranged in a grid pattern of three rows and three columns, nine drive bypass wires that input and output drive signals to and from the respective ultrasonic array units, a first common bypass wire to which a common potential is applied, coupled to the eight ultrasonic array units, a second common bypass wire coupled to the ultrasonic array unit to which the first common bypass wire is not coupled, and a third common bypass wire coupling the first and the second common bypass wires. One of the drive bypass wires, the first common bypass wire, and the second common bypass wire is placed between the ultrasonic array units placed adjacent to each other. The third common bypass wire is placed inside of the ultrasonic array unit placed adjacent to the ultrasonic array unit coupled to the second common bypass wire.