Ultrasonic Probe Backing Unit With Microlenses
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Solution Overview
Problem
Existing ultrasonic devices face challenges in suppressing unwanted ultrasonic waves, which lead to noise components that cause artifacts in B-mode imaging, particularly when the backing unit is made thin, resulting in reduced structural strength and increased noise emission.
Innovation Solution
The ultrasonic device incorporates a backing unit with microlenses and slits, where ultrasonic waves are focused and transmitted through the slits, allowing for efficient attenuation of unwanted waves by diffusing them back, thereby preventing noise from returning to the ultrasonic elements, while maintaining structural strength and minimizing thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the backing member is reduced to make the ultrasonic device thinner, then the device thickness is reduced, but the structural strength and attenuation capability deteriorate, causing increased noise emission
Solution Approach 1:
The backing member is segmented into multiple regions with different acoustic impedance values. Specifically, a first region with lower acoustic impedance and a second region with higher acoustic impedance are arranged in specific patterns, creating localized variations in acoustic properties that enhance attenuation while reducing overall thickness requirements
Solution Approach 2:
Different regions of the backing member are assigned different acoustic impedance characteristics tailored to specific functional needs. The first region with lower acoustic impedance is positioned to optimize certain attenuation paths, while the second region with higher acoustic impedance addresses other noise components, creating locally optimized acoustic performance throughout the structure
2Length of moving object
If the thickness of the backing member is reduced to make the ultrasonic device thinner, then the device thickness is reduced, but the attenuation capability deteriorates, causing increased noise emission
Solution Approach 1:
The backing member is divided into multiple regions with different acoustic impedance values. These segmented regions work together to attenuate unwanted ultrasonic waves through multiple scattering and reflection paths, achieving effective noise suppression without requiring increased overall thickness
Solution Approach 2:
The backing member employs a composite structure with regions of different acoustic impedance values, creating a functionally graded material system that optimizes both attenuation performance and structural integrity while maintaining reduced thickness
3Strength
If a metal plate is used as the backing member to secure structural strength, then the structural strength is improved, but the device thickness increases
Solution Approach 1:
Rather than using a single thick metal plate, the backing member is segmented into multiple thinner regions with varying acoustic impedance. This segmentation allows the structure to achieve the necessary structural strength through distributed support while maintaining reduced overall thickness
Solution Approach 2:
The backing member transitions from a homogeneous metal plate to a composite structure with regions of different acoustic impedance. This composite approach enables the design to achieve both structural strength and thickness reduction by optimizing the distribution and properties of different material regions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses unwanted ultrasonic waves, allowing for a thinner ultrasonic device that maintains structural integrity and reduces noise-related artifacts in imaging, enhancing the quality of ultrasonic probes and imaging apparatus.
Implementation Method 1
the microlenses are arranged on the second surface side of the ultrasonic elements so as to be located corresponding to the ultrasonic elements... ultrasonic waves are focused and transmitted through the slits
Implementation Method 2
allowing for efficient attenuation of unwanted waves by diffusing them back, thereby preventing noise from returning to the ultrasonic elements
Data Source
AI summary
An ultrasonic device that transmits and receives ultrasonic waves includes: ultrasonic elements having first and second surfaces from which the ultrasonic waves are emitted; and a backing unit that supports the second surfaces of the ultrasonic elements and attenuates the ultrasonic waves emitted to the second surface side. The backing unit includes microlenses, which are arranged on the second surface side of the ultrasonic elements so as to be located corresponding to the ultrasonic elements, and a backing member having slits through which the ultrasonic waves transmitted through the microlenses pass. The ultrasonic elements are arranged in the shape of an array, and the microlenses are arranged in the shape of an array corresponding to the ultrasonic elements.