Ultrasonic Cleaning Column for Substrate Backside Impurity Removal
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Solution Overview
Problem
Conventional cleaning processes fail to completely remove impurities from the back side of substrates during integrated circuit device manufacturing, particularly affecting semiconductor and display devices.
Innovation Solution
An apparatus and method utilizing a cleaning assembly with ultrasonic wave supply parts and a cleaning solution supply part to form a column of cleaning solution that contacts the back side of the substrate, employing adjustable frequencies and positioning to effectively clean the substrate without immersion or high-pressure spraying.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional cleaning process using cleaning solution is applied, then front side impurities are completely removed, but back side impurities are not completely removed
Solution Approach 1:
The cleaning system is segmented into multiple independent cleaning assemblies (first cleaning assembly and second cleaning assembly) positioned at different locations beneath the substrate. Each assembly has its own cleaning solution supply part and ultrasonic wave supply part, allowing simultaneous cleaning of different regions of the back side with optimized parameters for each region.
Solution Approach 2:
Different regions of the back side are cleaned with different local qualities: the first cleaning assembly uses a first frequency ultrasonic wave optimized for larger impurities, while the second cleaning assembly uses a second frequency ultrasonic wave optimized for smaller impurities. This local differentiation ensures comprehensive removal of various sized impurities across the entire back side.
2Area of stationary object
If cleaning solution is supplied in large amount, then cleaning coverage is improved, but cleaning solution consumption increases
Solution Approach 1:
The cleaning solution is extracted and delivered in a focused columnar form from the cleaning solution supply part to the back side of the substrate. This concentrated delivery method ensures that the cleaning solution is applied precisely where needed, maximizing cleaning coverage while minimizing overall solution consumption compared to flooding the entire substrate area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the cleaning efficiency of the back side of substrates, reducing failures and improving the reliability of integrated circuit devices by effectively removing impurities of varying sizes.
Implementation Method 1
an ultrasonic wave supply part applying an ultrasonic wave to the cleaning solution such that a column of the cleaning solution is formed from the cleaning solution supply part toward the back side of the substrate
Data Source
AI summary
An apparatus for cleaning a back side of a substrate may include a cleaning assembly which may include a cleaning solution supply part receiving a cleaning solution and an ultrasonic wave supply part applying an ultrasonic wave to the cleaning solution such that a column of the cleaning solution is formed from the cleaning solution supply part toward the back side of the substrate. The back side of the substrate may be cleaned by contacting the column of the cleaning solution with the back side of the substrate.