Ultrasonic Waveform Mapping for Weak Bond Boundary Detection
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Solution Overview
Problem
Conventional non-destructive testing techniques face difficulties in reliably identifying the boundary between sound and weak bonds in multilayer articles, which can lead to safety issues and increased maintenance costs due to potential catastrophic failures.
Innovation Solution
A method and system utilizing ultrasonic waves to generate full-wave, time domain waveforms at multiple positions on a multilayer article, comparing waveform characteristics to determine bond boundaries between sound and weak bonds, and memorializing the boundary positions for further analysis or repair.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional non-destructive testing techniques are used, then bond failure areas can be identified, but weak bond areas cannot be reliably identified
Solution Approach 1:
The patent changes the measurement parameters by using full-wave time domain waveforms instead of conventional amplitude-based measurements. By analyzing the complete waveform including transient responses and oscillation patterns, the system can detect subtle variations in bond strength that conventional techniques miss, thereby improving both measurement precision and reliability for identifying weak bonds.
Solution Approach 2:
The patent replaces conventional mechanical or simple ultrasonic amplitude-based testing with a more sophisticated waveform analysis system. By substituting the simple amplitude measurement approach with comprehensive time domain waveform analysis, the system achieves better detection capability for weak bonds while maintaining non-destructive testing.
2Productivity
If conventional ultrasonic testing is used, then testing can be performed quickly, but boundary identification between sound and weak bonds is unreliable
Solution Approach 1:
The patent introduces waveform characteristics as an intermediary between the ultrasonic signal and the bond quality assessment. By analyzing intermediate waveform parameters such as oscillation patterns, decay rates, and transient responses, the system achieves accurate boundary identification without sacrificing testing speed, as these characteristics provide rich information content that can be processed rapidly.
3Reliability
If weak bond regions are not accurately identified, then articles may be used with safety risks, but excising potentially defective regions increases material loss
Solution Approach 1:
The patent applies local quality analysis by examining waveform characteristics at specific local positions to determine bond quality. By identifying the precise location and extent of weak bonds through localized waveform analysis, the system enables targeted excision of only the defective regions rather than conservative large-area removal, thereby maintaining safety while minimizing material loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the ability to accurately identify and mark weak bond regions, enabling targeted repair or excision, thereby improving the safety and utility of multilayer articles by distinguishing sound from weak bonds with higher reliability.
Implementation Method 1
transmitting ultrasonic waves through the article via a transducer and generating a full-wave, time domain waveform based on reflected ultrasonic waves received by the transducer
Data Source
AI summary
A method of identifying a bond boundary between a sound bond and weak bond in a multilayer article may include determining a plurality of positions on a surface of the article; for each position of the plurality of positions, obtaining a full-wave, time domain waveform of ultrasonic waves reflected from the article; and, for each pair of adjacent positions among the plurality of positions, determining whether there is a bond boundary between a first position and a second position based on a comparison of a waveform characteristic of a first waveform generated at the first position and the waveform characteristic of a second waveform generated at the second position; and in response to a determination that there is a bond boundary between the first position and the second position, determining a boundary position based on the first position and the second position and memorializing the boundary position.