Multi-Directional Ultrasonic Bonding for Conductive Display Contacts
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Solution Overview
Problem
Existing ultrasonic bonding methods for electronic components in display devices face challenges in achieving reliable bonding, particularly due to issues with adhesive overlap and conductivity, which can lead to short defects or open defects.
Innovation Solution
An ultrasonic bonding apparatus with multiple ultrasonic generators vibrating in different directions is used to apply vibrations to the contact surface between the display panel and electronic component, simultaneously or sequentially, to form a conductive bonding layer directly between the panel and component, while also using a pressing part to manage adhesive placement and increase bonding reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional adhesive bonding methods are used, then bonding reliability is compromised due to adhesive overlap and conductivity issues, but the process is simpler and requires fewer components
Solution Approach 1:
The patent replaces traditional adhesive-based mechanical bonding with ultrasonic vibration-based bonding. The ultrasonic generators create high-frequency vibrations that directly bond the electronic component to the display panel through friction and heat at the contact interface, eliminating the need for adhesive materials and improving bonding reliability while reducing the risk of short defects and open defects caused by adhesive overlap and conductivity issues.
Solution Approach 2:
The patent divides the bonding function into multiple independent ultrasonic generators positioned at different locations (first, second, and third ultrasonic generators). Each generator independently provides ultrasonic vibrations to specific areas of the contact surface, allowing for precise control of the bonding process and enabling reliable bonding across large areas without requiring a single complex bonding system.
2Reliability
If multiple ultrasonic generators are used to improve bonding reliability, then bonding quality increases, but process time increases
Solution Approach 1:
The patent employs periodic ultrasonic vibrations from multiple generators simultaneously acting on the contact surface. The high-frequency periodic vibrations create rapid heating and cooling cycles at the bonding interface, enabling fast bonding without requiring prolonged exposure. This periodic action allows the bonding process to complete quickly while maintaining high reliability through consistent vibration application across multiple zones.
3Reliability
If ultrasonic vibration is applied to form conductive bonding layer, then conductivity improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies ultrasonic vibrations locally at the contact surfaces where electronic components meet the display panel, rather than requiring precision across the entire component. The ultrasonic generators are positioned to concentrate vibration energy precisely at the bonding interface, creating reliable conductive bonds only where needed. This local application of ultrasonic energy reduces the overall manufacturing precision requirements while ensuring high-quality electrical contact at critical bonding points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of electrical contact by forming a conductive bonding layer with higher conductivity than traditional adhesive methods, reduces process time, and minimizes defects, thereby improving the bonding efficiency and stability of electronic components on display panels.
Implementation Method 1
a first converter which converts electrical signals into a first vibration vibrating in the first direction, and a first booster which amplifies an amplitude of the first vibration
Implementation Method 2
a second converter which converts electrical signals into a second vibration vibrating in the third direction, and a second booster which amplifies the amplitude of the second vibration
Implementation Method 3
bonding the display panel and the electronic component to each other by having the head part and the display panel vibrate together
Data Source
AI summary
An ultrasonic bonding apparatus includes a stage having an upper surface on a plane defined by a first direction and a second direction crossing the first direction, a head part spaced apart from the stage in a third direction crossing the first direction and the second direction, a first ultrasonic generator which vibrates in a direction parallel to the first direction, and a second ultrasonic generator which vibrates in a direction parallel to the third direction, where each of the first ultrasonic generator and the second ultrasonic generator may be coupled to the stage or the head part.