Ultrasonic Bonding Gap Detection for Reliable Conductor Connections
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Solution Overview
Problem
Existing ultrasonic connection methods for power electronics components face challenges in ensuring a reliable, high-quality connection due to manufacturing tolerances that create gaps between components, requiring precise monitoring of process parameters like contact time and force to maintain connection quality and prevent errors.
Innovation Solution
An ultrasonic connection method using a movable ultrasonic head with a carrier and an ultrasound generating device, where the gap between the connection conductor and the connection area is determined, and the contact time is calculated by measuring the difference in travel position and relative position of the ultrasound head and generating device, allowing for precise control and monitoring of the connection process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the ultrasonic tool is lowered to close the gap between the connecting conductor and connection area, then the connection is established, but the process force is consumed for elastic deformation before bonding occurs
Solution Approach 1:
The patent measures the gap distance before the ultrasonic connection process and calculates the required travel distance in advance. This preliminary measurement and calculation allow the system to compensate for the gap and positioning tolerances before the actual bonding occurs, ensuring that the full process force is available for bonding rather than being consumed by elastic deformation.
2Reliability
If the gap between components is reduced to improve connection quality, then bonding reliability increases, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs a feedback mechanism where the gap distance is measured before the connection process, and this measurement is used to calculate and adjust the travel distance of the ultrasonic tool. This closed-loop approach compensates for variations in gap size caused by manufacturing tolerances, allowing reliable connections without requiring extremely tight manufacturing precision.
Solution Approach 2:
The gap measurement and travel distance calculation are performed in advance before the actual connection process. This preliminary action allows the system to adapt to the actual gap conditions and adjust the process parameters accordingly, reducing the impact of manufacturing tolerances on connection quality.
3Reliability
If the process parameters are monitored precisely to ensure connection quality, then connection reliability improves, but measurement and control complexity increase
Solution Approach 1:
The patent replaces complex real-time force and position monitoring during the ultrasonic connection process with a simpler pre-process measurement and calculation approach. By measuring the gap distance before connection and calculating the required travel distance, the system achieves reliable connections without requiring sophisticated real-time monitoring equipment.
4Reliability
If safety margins are increased to prevent connection errors, then connection reliability improves, but process time increases
Solution Approach 1:
The patent performs gap measurement and travel distance calculation in advance, allowing the system to optimize the connection parameters for each specific case. This eliminates the need for conservative safety margins and extended process times, as the system is already adapted to the actual gap conditions before the connection begins.
Solution Approach 2:
The patent dynamically adjusts the travel distance parameter based on the measured gap size and calculated requirements. This parameter optimization allows the system to achieve reliable connections with precise control, eliminating the need for excessive safety margins and reducing overall process time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures a safe and controlled connection process, reducing errors and increasing throughput by accurately determining the contact time and process force, thereby improving the economic efficiency and quality of the ultrasonic connection.
Implementation Method 1
an ultrasonic tool which can be excited by the ultrasonic generating device to produce ultrasonic vibration
Data Source
Figure 1~2
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AI summary
The invention relates to a method for operating an ultrasonic connecting device. The ultrasonic connecting device provides an ultrasonic head (1) which can be moved in a z-direction, comprising a support (2), an ultrasonic generating device (3) which is held on the support (2) in a movable manner relative thereto, and an ultrasonic tool (4) which can be excited by the ultrasonic generating device (3) so as to generate ultrasonic vibrations. The method has the following steps: an electrically conductive connection conductor (6) is positioned above an electrically conductive connection region (8) provided on a connection component (7) such that a gap (10) with a gap size (s) which is determined in the z-direction and which has an unknown magnitude is formed between the connection conductor and the connection surface (9) of the connection region (8) facing the connection conductor (6); the ultrasonic head (2) is positioned relative to the connection conductor (6) and the connection component (7) such that a contact surface (5) of the ultrasonic tool (4), said contact surface being designed to contact the connection conductor (6), faces the connection conductor (6); a bonding force (FB) acting in the z-direction is applied to the ultrasonic generating device (7), and the ultrasonic generating device is pressed against the support (2); the ultrasonic head (1) is then lowered in the z-direction and a movement position (Z) of the ultrasonic head (1) in the z-direction and the position (ZNL) of the ultrasonic generating device (3) relative to the support (2), determined in the z-direction, are ascertained; and a contact time (t1), at which the connection conductor (6) is lowered by the ultrasonic tool (4) to such an extent that the connection conductor contacts the connection region (8) of the connection component (7), and a corresponding closing force (FG) are ascertained while taking into consideration the movement position (z) and the relative position (ZNL).