Ultrasonic Inspection Device for Bonding Interface Imaging
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Solution Overview
Problem
Existing ultrasonic inspection methods using S-Gate and F-Gate techniques face challenges in generating clear images of bonding interfaces due to uneven surface roughness and difficulty in setting appropriate trigger points, leading to misalignment and incorrect detection of surface echoes.
Innovation Solution
An ultrasonic inspection device and method that defines a first gate and multiple second gates with narrower time widths, detects lower layer echoes, and adjusts reception times to generate clear cross-sectional images without relying on S-Gate, allowing for accurate detection of bonding defects even on uneven surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If S-Gate and F-Gate techniques are used for ultrasonic inspection, then defect detection capability is improved, but image clarity and detection accuracy deteriorate due to uneven surface roughness and difficulty in setting appropriate trigger points
Solution Approach 1:
The patent extracts and eliminates the S-Gate trigger point setting mechanism from the inspection system. By removing this problematic component, the system avoids the issues of surface roughness sensitivity and trigger point misalignment, thereby improving image clarity while maintaining defect detection capability through alternative methods that do not rely on surface echo triggers
Solution Approach 2:
Instead of using surface echo triggers (S-Gate) to initiate inspection, the patent inverts the approach by using subsurface interface echoes as reference points. This inversion allows the system to focus on the actual inspection region without being distracted by surface irregularities, improving both image clarity and detection accuracy
2Adaptability or versatility
If S-Gate is used to detect surface echoes, then inspection coverage is improved, but operational convenience deteriorates due to difficulty in setting appropriate trigger points on uneven surfaces
Solution Approach 1:
The system performs self-alignment by automatically detecting interface echoes and using them as reference points for subsequent inspections. This self-service mechanism eliminates the need for manual trigger point setting, making the system operationally convenient while maintaining comprehensive inspection coverage through automatic adaptation to surface variations
3Reliability
If feature amounts are calculated and local peaks are plotted in feature space for defect detection, then defect identification capability is improved, but device complexity increases due to trial and error in selecting feature amounts and adjusting association standards
Solution Approach 1:
The system automatically identifies and associates local peaks based on their temporal relationships and echo characteristics without requiring manual feature selection. The interface echo detection mechanism self-determines the relevant features and association criteria, eliminating trial and error while maintaining high defect identification capability
Solution Approach 2:
The system performs preliminary detection of interface echoes to establish reference time points before conducting the actual defect inspection. This preliminary action simplifies subsequent processing by pre-establishing the temporal framework for association, reducing device complexity while improving defect identification
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a highly convenient and accurate method for generating clear images of bonding interfaces and detecting defects, such as delaminated portions, without the need for complex S-Gate settings, effectively addressing the limitations of existing techniques.
Implementation Method 1
an ultrasonic probe configured to generate an ultrasonic wave, transmit the ultrasonic wave to an inspection object
Implementation Method 2
receive a reflected wave from the inspection object
Implementation Method 3
reflection characteristics based on differences in acoustic impedance are used. The ultrasonic wave propagates into a liquid or solid substance, and a reflected wave (echo) is generated at a boundary surface or a gap between materials that are different in acoustic impedance
Data Source
AI summary
Provided is an ultrasonic inspection device and method capable of generating a clear image of a desired bonding interface without an S-Gate. The controller in the ultrasonic inspection device is configured to: (A) define a first gate indicating a time range in which a part of a reflected wave is extracted based on a predetermined condition received; (B) define one or more second gates each indicating a time width smaller than that of the first gate before an end time of the first gate; (C) for each of a plurality of measurement points of an inspection object, (C1) detect a lower layer echo or a local peak, (C2) adjust a reception time of the reflected wave based on the lower layer echo or the local peak; and (D) generate a cross-sectional image of the inspection object based on the reflected wave.