Ultrasonic Transducer Bonding for Load-Indicating Fasteners
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Solution Overview
Problem
Existing methods for attaching piezoelectric ultrasonic transducers to connection components, such as screws, are costly and inefficient, particularly for large components, and are susceptible to temperature and chemical influences, leading to unreliable measurements due to glue degradation and environmental factors.
Innovation Solution
A method involving a reactive layer system with solder layers is used to securely attach the piezoelectric ultrasonic transducer to the connection element, utilizing a reactive layer that undergoes an exothermic reaction to melt the solder layers, forming a stable connection without extensive heating, suitable for large components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vapor deposition methods are used to attach the ultrasonic transducer, then temperature resistance and measurement reliability are improved, but production costs and device complexity increase significantly
Solution Approach 1:
A reactive layer is introduced as an intermediary between the connection component and the ultrasonic transducer. This reactive layer, when activated, forms a metallurgical bond that provides temperature resistance and measurement reliability without requiring complex vapor deposition equipment. The reactive layer acts as a mediator that achieves reliable attachment through a simpler, more cost-effective process.
2Reliability
If vapor deposition methods are used to attach the ultrasonic transducer, then temperature resistance and measurement reliability are improved, but production time and costs increase due to limited plant volume
Solution Approach 1:
The reactive layer serves as an intermediary that enables attachment without requiring large-volume vapor deposition plants. By using this reactive layer with activation capability, the process can be performed in more compact equipment, thereby increasing throughput and reducing production time while maintaining measurement reliability.
3Ease of manufacture
If glue layers are used to attach the ultrasonic transducer, then ease of manufacture is improved, but measurement reliability deteriorates due to temperature dependence and chemical resistance issues
Solution Approach 1:
The attachment method transitions from chemical bonding (glue) to metallurgical bonding through the reactive layer. By changing the bonding mechanism parameter, the system achieves temperature resistance and chemical resistance comparable to vapor deposition while maintaining ease of manufacture. The reactive layer can be activated through various means (heat, electricity, mechanical) to form a reliable bond.
4Adaptability or versatility
If larger connection components are produced, then applicability to wind power sector is improved, but production costs increase exponentially due to limited plant volume
Solution Approach 1:
The reactive layer acts as an intermediary that enables cost-effective attachment of ultrasonic transducers to large connection components used in the wind power sector. This approach avoids the exponential cost increase associated with vapor deposition for large components, making the technology economically viable for wind turbine applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides a reliable, cost-effective, and durable connection that maintains measurement accuracy across varying temperatures and chemical environments, eliminating issues associated with glue degradation and ensuring consistent ultrasonic signal propagation.
Implementation Method 1
The reactive layer is adapted for an exothermic reaction by activation with heat, electromagnetic radiation or electric current
Implementation Method 2
the ultrasonic transducer is pressed in the direction of the connection element to generate a specified contact pressure. While the layer structure is pressed, the reactive layer is activated
Data Source
AI summary
The disclosure relates to a method for producing load-indicating connection components. A connection element (10) and a piezoelectric ultrasonic transducer (20) are provided and interconnected. The method comprises forming a layer structure on the surface (14) of the connection element (10). The layer structure comprises, in this order, proceeding from the surface (14) of the connection element (10): a first solder layer (16); a reactive layer (30); a second solder layer (22); and the piezoelectric ultrasonic transducer (20). The reactive layer (30) is designed for an exothermic reaction by activation with heat, with electromagnetic radiation or with electric current. Subsequently, the piezoelectric ultrasonic transducer (20) is pressed toward the connection element (10) in order to produce a specified contact pressure, and the reactive layer (30) is activated. The disclosure also relates to a load-indicating connection component of this type.