Ultrasonic Bonding Protrusion Height Gradient

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional ultrasonic bonding techniques often lead to material thinning around outer protrusions, resulting in increased stress concentrations and the risk of crack formation due to shrinkage and external forces, which can cause material breakage.

Innovation Solution

The use of ultrasonic bonding equipment with anvil and horn protrusions of varying heights, where the outer protrusions apply a lesser gripping force than the inner protrusions, reducing material stress and increasing the thickness of the bonded material's outer region, thereby enhancing rupture and fatigue strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If uniform protrusions are used in ultrasonic bonding, then bonding consistency is improved, but material thinning and stress concentration occur at outer regions

Engineering Contradiction:
Improvebonding consistencyVSAvoidmaterial strength at outer region
Core Design Contradiction:
Stability of the object's compositionVSStrength

Solution Approach 1:

The patent applies local quality by varying the height of protrusions based on their position: inner protrusions have a first height while outer protrusions have a second height that is 0.5 to 0.8 times the first height. This localized differentiation ensures that outer regions experience less gripping force and material thinning, while inner regions maintain strong bonding consistency.

Inventive Principle:
Principle #3Local quality

2Strength

If high gripping force is applied uniformly, then bonding strength is improved, but material thinning and crack risk increase

Engineering Contradiction:
Improvebonding strengthVSAvoidmaterial thinning and crack risk
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent implements local quality by creating a gradient in gripping force through varied protrusion heights. Inner protrusions apply higher gripping force for strong bonding, while outer protrusions apply reduced gripping force (40-80% of inner force) to prevent material thinning and crack formation at stress-prone outer regions.

Inventive Principle:
Principle #3Local quality

3Reliability

If outer protrusions grip tightly, then bonding completeness is improved, but stress concentration and material breakage risk increase

Engineering Contradiction:
Improvebonding completenessVSAvoidmaterial thickness uniformity
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies local quality by differentiating protrusion heights to match the varying thickness requirements of different material regions. Outer protrusions with reduced height (0.5-0.8 times inner protrusion height) maintain bonding completeness while preserving outer material thickness, ensuring uniformity within ±0.05mm.

Inventive Principle:
Principle #3Local quality

4Device complexity

If uniform protrusion height is used, then device simplicity is maintained, but outer region material stress increases

Engineering Contradiction:
Improveprotrusion structure simplicityVSAvoidmaterial stress at outer region
Core Design Contradiction:
Device complexityVSStress or pressure

Solution Approach 1:

The patent implements local quality through a straightforward height differentiation scheme where outer protrusions are simply made 0.5 to 0.8 times the height of inner protrusions. This minimal structural modification effectively reduces material stress at outer regions without significantly complicating the overall device design.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces crack generation and improves the rupture and fatigue strength of the bonded materials by maintaining a thicker outer region, alleviating stress concentrations from external forces like tensile loads and vibrations.

Implementation Method 1

the horn concurrently applies a back-and-forth linear motion from the supersonic vibration transferred through the horn from a transducer that generates the vibration

Methodology Applied
Scientific EffectUltrasonic vibration: Ultrasonic Vibration

Implementation Method 2

the materials undergo solid-state welding from the frictional heat generated by the contact of the two clean material surfaces

Methodology Applied
Scientific EffectFrictional heat: Friction

Data Source

PatentUS7793815B2Ultrasonic bonding equipment and resulting bonding structure
Publication Date: 2010.09.14 ENVISION AESC JAPAN LTD
  • US7793815B2 patent drawing
  • US7793815B2 patent drawing
  • US7793815B2 patent drawing

AI summary

The disclosure is directed to ultrasonic bonding equipment, in which the anvil and horn include protrusions of varying height to grip the material being bonded. The outer protrusions may form smaller or differently shaped indentations in the material to reduce material stresses of the material at the outer region of the material. An exemplary embodiment of an ultrasonic bonding system includes an anvil and a horn arranged facing the anvil to ultrasonically bond a gripped portion of two or more layers of material. The gripped portion of the layers includes an inner region and an outer region. The anvil and the horn apply a gripping force to the outer region that is less than a gripping force applied to the inner region of the gripped materials.