Ultrasonic Bonding Apparatus Temperature Feedback Control
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Solution Overview
Problem
In ultrasonic bonding, there is a challenge in maintaining the bonding strength of target members due to temperature fluctuations during the bonding process, which affects the quality and reliability of the bonding process.
Innovation Solution
An ultrasonic bonding apparatus that includes a temperature sensor to detect the temperature of the bonding target members and a control device that adjusts control parameters such as pressurizing force, ultrasonic vibration amplitude, and bonding time based on the detected temperature to maintain optimal bonding conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ultrasonic bonding is performed without temperature monitoring and control, then the bonding process is simple and fast, but the bonding strength decreases due to temperature fluctuations
Solution Approach 1:
The patent implements a feedback control system where a temperature sensor continuously monitors the temperature of the bonding target member during ultrasonic bonding, and the control device adjusts control parameters (ultrasonic vibration amplitude, pressurizing force, bonding time) based on the detected temperature to maintain optimal bonding conditions and prevent bonding strength degradation
Solution Approach 2:
The control device dynamically changes control parameters (ultrasonic vibration amplitude, pressurizing force, bonding time) based on real-time temperature detection to maintain optimal bonding conditions, thereby resolving the contradiction between maintaining bonding strength and avoiding excessive control complexity
2Reliability
If control parameters are adjusted in real-time based on temperature detection, then bonding strength is maintained, but the operation complexity increases
Solution Approach 1:
The control device automatically adjusts control parameters based on temperature detection without requiring manual intervention, enabling the system to self-regulate bonding conditions and maintain consistent quality while keeping the operation simple for the user
3Reliability
If temperature monitoring and parameter adjustment are implemented, then bonding strength decrease is suppressed, but the device complexity increases
Solution Approach 1:
The apparatus incorporates a temperature sensor and control device that form a feedback loop to monitor and adjust bonding parameters in real-time, suppressing bonding strength degradation while managing device complexity through automated control
Solution Approach 2:
The control device performs multiple functions including temperature monitoring, parameter adjustment, and bonding control within a single integrated system, reducing overall device complexity while maintaining bonding strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively suppresses a decrease in bonding strength by ensuring real-time temperature monitoring and adjusting control parameters, thereby maintaining consistent and high-quality bonding of the target members.
Implementation Method 1
a bonding tool 8 arranged above the bonding target members 2, 3 in the height direction Z1, Z2, and through being driven in a state of using pressurizing force to press the bonding target members 2, 3 downward in the height direction while transmitting ultrasonic vibration which vibrates in a direction intersecting this height direction to the bonding target members 2, 3, bonds the target members
Implementation Method 2
the temperature of a bonding target member rises sharply with the start of ultrasonic bonding
Data Source
AI summary
An ultrasonic bonding apparatus includes a temperature sensor that detects a temperature of a bonding target member arranged on an upper side of a stage. The ultrasonic bonding apparatus includes a control device that changes a control parameter associated with the driving of a bonding tool based on information related to the temperature detected by the temperature sensor.