Ultrasonic Bonding Control for Height-Direction Vibration
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Solution Overview
Problem
In ultrasonic bonding, varying shapes of bonding target members can lead to a decrease in bonding strength due to increased vibration amplitude along the height direction, which existing technologies fail to effectively manage.
Innovation Solution
An ultrasonic bonding apparatus with a control device that adjusts control parameters, such as pressurizing force and ultrasonic vibration amplitude, based on real-time vibration measurements along the height direction, using sensors like eddy current or laser displacement sensors to maintain optimal bonding strength by suppressing vibration amplitude.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If ultrasonic bonding is performed on bonding target members with varying shapes, then the bonding process can accommodate different member geometries, but the bonding strength decreases due to increased vibration amplitude along the height direction
Solution Approach 1:
The patent employs a sensor to detect vibration amplitude along the height direction of the bonding target member during ultrasonic bonding. The control device receives this detection result and adjusts control parameters (such as pressurizing force or ultrasonic vibration amplitude) based on the detected vibration amplitude. This closed-loop feedback mechanism ensures that bonding strength is maintained across different member shapes by dynamically compensating for shape-induced vibration variations.
Solution Approach 2:
The control parameters during ultrasonic bonding are made dynamic rather than fixed. The system continuously monitors vibration amplitude and adjusts pressurizing force or ultrasonic amplitude in real-time based on the detected vibration characteristics. This dynamic adjustment allows the bonding process to adapt to varying member geometries while maintaining consistent bonding quality.
2Adaptability or versatility
If vibration amplitude along the height direction increases due to varying member shapes, then different shapes can be bonded, but the bonding strength decreases
Solution Approach 1:
A sensor detects the vibration amplitude along the height direction in real-time during bonding. The control device uses this detection result to adjust control parameters, creating a feedback loop that maintains bonding strength despite variations in member shape that cause different vibration amplitudes.
Solution Approach 2:
The system changes control parameters (pressurizing force, ultrasonic vibration amplitude) based on the detected vibration amplitude. By dynamically adjusting these parameters according to the actual vibration state, the system compensates for shape-induced variations and maintains consistent bonding strength across different member geometries.
3Strength
If control parameters are adjusted based on real-time vibration measurements, then bonding strength is maintained, but the device complexity increases due to addition of sensors and control systems
Solution Approach 1:
The patent introduces a sensor and control device that form a feedback system. The sensor detects vibration amplitude along the height direction, and the control device adjusts control parameters based on this detection result. This feedback mechanism maintains bonding strength while adding necessary control complexity to manage varying member shapes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively maintains bonding strength by controlling vibration amplitude, ensuring consistent bonding performance even with differently shaped bonding target members, thereby preventing a decrease in bonding strength.
Implementation Method 1
sensors like eddy current or laser displacement sensors
Implementation Method 2
sensors like eddy current or laser displacement sensors
Implementation Method 3
ultrasonic vibration is transmitted from the bonding tool to the bonding target member
Implementation Method 4
In ultrasonic bonding, a bonding target member is arranged between a stage and a bonding tool, and ultrasonic vibration is transmitted from the bonding tool to the bonding target member in a state where the bonding tool presses the bonding target member, thereby bonding the bonding target member
Data Source
AI summary
An ultrasonic bonding apparatus includes a sensor that detects vibration along a height direction in a bonding target member which vibrates by ultrasonic vibration. The ultrasonic bonding apparatus includes a control device that changes control parameters associated with the driving of a bonding tool based on information related to the vibration along the height direction detected by the sensor.


