Ultrasonic Bonding Feedback Control via Vibration State Detection
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Solution Overview
Problem
Existing ultrasonic bonding technologies struggle to accurately determine the fracture mode of all bonding members post-bonding, making it difficult to control the bonding process effectively.
Innovation Solution
An ultrasonic bonding apparatus and method that includes a sensor to detect the vibration state of bonding members during the bonding process, allowing for real-time determination of the bonding state and fracture mode, and adjusts the bonding parameters accordingly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If ultrasonic bonding is performed using conventional methods with external sensors, then bonding strength can be estimated, but fracture modes of all bonding members cannot be determined
Solution Approach 1:
The patent replaces mechanical post-bonding tensile testing with acoustic emission detection during the bonding process itself. Acoustic sensors detect sound waves generated by fracture events in real-time, allowing determination of fracture modes without mechanical destruction after bonding. This substitution enables continuous monitoring and information capture during the bonding process rather than requiring separate testing steps.
Solution Approach 2:
The system implements real-time feedback by continuously monitoring acoustic emission signals during ultrasonic bonding. The bonding state and fracture modes are determined based on acoustic emission waveforms, allowing immediate identification of bonding quality and fracture characteristics. This feedback mechanism enables in-process quality control rather than post-process inspection.
2Loss of information
If post-bonding tensile testing is performed to determine fracture modes, then fracture information can be obtained, but all bonding members cannot be inspected
Solution Approach 1:
The patent enables continuous acoustic emission monitoring throughout the entire bonding process, allowing all bonding members to be inspected simultaneously as they are bonded. The acoustic sensors continuously detect fracture events in real-time without interruption, providing uninterrupted information on the bonding state of all members. This eliminates the need for discrete post-bonding testing of individual samples.
Solution Approach 2:
The system replaces time-consuming mechanical tensile testing with rapid acoustic emission detection. Acoustic sensors instantly detect fracture events as they occur during bonding, providing immediate information on fracture modes for all bonding members. This substitution dramatically reduces inspection time from post-bonding mechanical testing to real-time acoustic monitoring during the bonding process.
3Ease of operation
If conventional ultrasonic bonding control is used, then bonding can be performed, but precise control based on real-time bonding state is difficult
Solution Approach 1:
The system implements real-time feedback control by continuously monitoring acoustic emission signals during bonding. The bonding state is determined based on acoustic emission waveforms, providing immediate information on bonding progress and quality. This feedback enables dynamic adjustment of bonding parameters to maintain optimal bonding conditions and ensure consistent quality across all bonding members.
Solution Approach 2:
The patent enables preliminary determination of bonding state and fracture mode before the bonding process is complete. By continuously monitoring acoustic emissions during bonding, the system can identify bonding quality issues and fracture risks in advance, allowing corrective actions to be taken before defective bonds are finalized. This preliminary detection capability improves bonding reliability by preventing defective bonds.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise control of the bonding process by identifying defective bonds and optimizing bonding conditions, thereby improving yield and enabling more accurate quality control.
Implementation Method 1
a sensor to detect the vibration state of bonding members during the bonding process
Implementation Method 2
uses a bonding tool to apply pressure and an ultrasonic wave to bonding members placed on a stage, and bond the bonding members together
Data Source
AI summary
According to one embodiment, an ultrasonic bonding method for bonding a plurality of bonding members together by applying pressure and an ultrasonic wave includes a pressing step of applying pressure to one bonding member and another bonding member so as to press against each other, an application step of applying an ultrasonic wave to the one bonding member, a detection step of detecting a vibration state of another bonding member during the application step, and a step of determining a state of bonding between the bonding members based on the vibration state acquired in the detection step.