Ultrasonic Bonding Head Timing to Prevent Multi-Point Wave Interference
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Solution Overview
Problem
Conventional multi-position ultrasonic bonding methods for solar cell substrates face bonding failures due to overlapping ultrasonic vibrations, leading to inaccurate bonding at multiple positions.
Innovation Solution
The use of multiple ultrasonic bonding head units with controlled ultrasonic vibration operations ensures that vibrations do not overlap in time, allowing for efficient and accurate bonding across multiple positions by synchronizing the ultrasonic time conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple ultrasonic bonding head units are used to bond multiple positions simultaneously, then productivity is improved, but manufacturing precision deteriorates due to wave motion interference
Solution Approach 1:
The patent applies periodic action by sequentially activating ultrasonic bonding head units in a time-separated manner. The control unit activates each bonding head unit in turn, ensuring that the ultrasonic vibration period of one head unit completes before the next one starts. This periodic, non-overlapping activation pattern allows multiple bonding positions to be processed simultaneously in terms of positioning, while maintaining temporal separation of ultrasonic vibrations to prevent wave interference, thus preserving bonding accuracy while improving productivity.
2Productivity
If ultrasonic vibrations are applied simultaneously at multiple bonding positions, then productivity is improved, but manufacturing precision deteriorates due to overlapping wave motions
Solution Approach 1:
The patent implements periodic action by controlling the activation timing of multiple ultrasonic bonding head units. The control unit ensures that each bonding head unit operates in distinct time periods, with the ultrasonic vibration period of one unit completing before the next unit activates. This temporal sequencing maintains non-overlapping vibration cycles, preventing wave motion interference while enabling parallel positioning of multiple bonding operations, thereby resolving the contradiction between improved productivity and maintained bonding accuracy.
3Productivity
If the number of bonding positions is increased, then productivity is improved, but reliability deteriorates due to bonding failure phenomenon
Solution Approach 1:
The patent applies periodic action by sequencing the activation of ultrasonic bonding head units so that each unit completes its ultrasonic vibration cycle before the next unit activates. This time-separated periodic operation prevents wave motion interference that would otherwise cause bonding failures. By ensuring that ultrasonic vibrations at different bonding positions do not overlap in time, the system maintains high bonding reliability even when processing multiple bonding positions, thus enabling increased production capacity without sacrificing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents adverse wave motion interference, enabling high-accuracy ultrasonic bonding on multiple positions without affecting other bonding operations, thus improving production efficiency and accuracy.
Implementation Method 1
an ultrasonic vibration bonding apparatus, which executes an ultrasonic bonding process to apply ultrasonic waves while applying pressure to the electrode wire disposed on the substrate
Data Source
AI summary
In an ultrasonic bonding method, three ultrasonic bonding head units are disposed above a bonding target. At this time, initial heights in the three ultrasonic bonding head units are set to different heights from each other. Thereafter, a batch multiple lowering operation by a lifting-lowering servomotor and ultrasonic vibration operations by the three ultrasonic bonding head units are executed. At this time, a lowering speed V6 of the batch multiple lowering operation, an operation time T6 (min) of the ultrasonic vibration operation, and an adjustment gap length Δg among the initial heights are set to satisfy {T6<Δg/V6}.