Ultrasonic Transceiver Chip for Touch, Force, and Thermal Sensing
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Solution Overview
Problem
Existing ultrasonic sensors face challenges in accurately measuring force, temperature, and material properties of objects in contact, such as differentiating between materials based on thermal conductance and temperature, beyond mere touch detection.
Innovation Solution
The integration of ultrasonic transceiver chips with semiconductor integrated circuits and flexible bases for touch, force, and thermal sensing, utilizing in-chip acoustic communication links and nodes to measure surface properties, including a flexible membrane with ultrasonic transceiver sensors for touch, force, and temperature detection, and a substrate with piezoelectric transducers for soil condition monitoring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional ultrasonic transducers are used for touch detection, then simple contact sensing is achieved, but the ability to differentiate material properties, thermal conductance, and temperature is insufficient
Solution Approach 1:
The ultrasonic transceiver chip is designed to perform multiple sensing functions including touch detection, force measurement, temperature sensing, and material property characterization using a single integrated device. The same ultrasonic transducer array and processing circuitry are used across all sensing modalities, eliminating the need for separate sensors for each function and resolving the contradiction between measurement precision and device complexity.
Solution Approach 2:
The system measures multiple parameters (time of flight, signal amplitude, frequency response) from ultrasonic wave interactions with contacted objects. By analyzing changes in these physical parameters, the system differentiates between various material properties, thermal conductances, and temperatures, thereby improving measurement precision without requiring additional complex hardware.
2Adaptability or versatility
If multiple separate sensors are used for touch, force, and temperature sensing, then comprehensive sensing capability is achieved, but device complexity and integration difficulty increase
Solution Approach 1:
The patent integrates touch sensors, force sensors, and temperature sensors into a single ultrasonic transceiver chip. The ultrasonic transducer array and signal processing circuitry are combined on one chip, allowing multiple sensing functions to be performed simultaneously by the same hardware components, thus achieving versatility while reducing integration complexity.
Solution Approach 2:
The same ultrasonic transceiver chip performs multiple sensing functions (touch, force, temperature) that would traditionally require separate sensor devices. This multi-functional design reduces the overall system complexity and integration difficulty while maintaining comprehensive sensing capability.
3Measurement precision
If ultrasonic transceiver chips with multiple sensing functions are integrated, then measurement accuracy for force and temperature is improved, but manufacturing complexity increases
Solution Approach 1:
The ultrasonic transceiver chip is divided into functional segments including piezoelectric transducer elements, signal processing circuits, and sensing nodes. Each segment can be fabricated using standard semiconductor manufacturing processes, allowing complex multi-functional chips to be manufactured through modular assembly of these segments, thereby improving ease of manufacture while maintaining measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise measurement of force, temperature, and material properties, providing enhanced differentiation and characterization of objects, suitable for applications like robotic interfaces and soil condition monitoring.
Implementation Method 1
an array of piezoelectric transducers, each piezoelectric transducer coupled to the CMOS layer and operable to generate ultrasonic pulses
Implementation Method 2
generate an ultrasonic pulse by a piezoelectric transducer of the array that is directed to propagate through the substrate and the contact layer to the surface in contact with the soil or the object in the soil, such that a reflected ultrasonic pulse is produced at the surface that propagates through the contact layer and the substrate to be received at the array of piezoelectric transducers
Implementation Method 3
receive and process outputs from the piezoelectric transducers produced in response to the received reflected ultrasonic pulses
Data Source
Figure 1A~1B
Figure 1C~1D
Figure 2A~2B
AI summary
Disclosed are devices, systems and methods for touch, force and/or thermal sensing by an ultrasonic transceiver chip. In some aspects, an ultrasonic transceiver sensor device includes a semiconductor substrate; a CMOS layer attached to the substrate; an array of piezoelectric transducers coupled to the CMOS layer to generate ultrasonic pulses; and a contact layer attached to the substrate on a side opposite the substrate for providing a surface for contact with an object, where an ultrasonic pulse generated by a piezoelectric transducer propagates through the substrate and the contact layer, such that when the object is in contact with the surface of the contact layer, a reflected ultrasonic pulse is produced and propagates through the contact layer and the substrate to be received at the array of piezoelectric transducers, and the CMOS layer receive and process outputs from the piezoelectric transducers produced in response to the received reflected ultrasonic pulses.