Ultrasonic Transducer Chip Shielding for Polarization Breakdown
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Solution Overview
Problem
High voltages required for polarization of the piezoelectric layer in ultrasonic transducers cause breakdowns in small-spacing metal blocks and suspended metal blocks in the circuit module, affecting yield and signal integrity.
Innovation Solution
A conductive shielding layer is placed between the circuit module and the acoustic layer, grounded to guide induced charges to ground, reducing interference and breakdowns, and improving signal-to-noise ratio.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high voltage is applied for polarization of the acoustic layer, then the acoustic layer can be properly polarized, but the small-spacing metal blocks and suspended metal blocks in the circuit module are easily broken down
Solution Approach 1:
A conductive shielding layer is introduced as an intermediary component between the acoustic layer and the circuit module. This shielding layer is grounded and receives induced charges during polarization, preventing direct high voltage stress from reaching the metal blocks in the circuit module, thus resolving the contradiction between achieving effective polarization and preventing breakdown
2Device complexity
If the circuit module is placed close to the acoustic layer for integration, then device complexity is reduced, but signal integrity is compromised due to interference from high voltage
Solution Approach 1:
The conductive shielding layer serves as a mediator that enables close integration of the circuit module with the acoustic layer while maintaining signal integrity. By grounding the shielding layer and providing a path for induced charges, it electrically isolates the circuit module from high voltage interference, allowing both components to be closely positioned without compromising performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conductive shielding layer effectively prevents breakdowns in the circuit module, enhancing yield and signal quality by guiding induced charges to ground, thus improving the reliability of the ultrasonic transducer.
Implementation Method 1
guiding, during polarization of an acoustic layer of the ultrasonic transducer, induced charges above the acoustic layer to ground through a conductive shielding layer
Data Source
AI summary
A chip for an ultrasonic transducer, an ultrasonic transducer, an electronic device, and a method for preparing a chip are provided. The chip is arranged below an acoustic layer, and the chip comprises: a substrate; a circuit module arranged in the substrate; and a conductive shielding layer arranged between the circuit module and the acoustic layer, wherein a projection of the conductive shielding layer on the substrate at least covers a projection of the circuit module on the substrate, and the conductive shielding layer is grounded.