Ultrasonic Conductor Bonding Layout for Dissimilar Wire Materials
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods struggle to achieve high bonding strength when bonding conductors made of different materials, particularly when one material is difficult to deform, leading to inconsistent bonding and reduced adhesion due to surface oxides and differing deformation properties.
Innovation Solution
The conductors are arranged such that those difficult to deform are interspersed with those easy to deform, forming a symmetrical pattern relative to a center line, and ultrasonically bonded using an anvil, horn, and gathers to ensure uniform deformation and bonding across the assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conductors of different materials are bonded together using conventional ultrasonic welding, then bonding between dissimilar materials is achieved, but bonding strength is insufficient due to differences in deformation properties and oxide film presence
Solution Approach 1:
The patent applies local quality by arranging conductors with different deformation characteristics (easy-to-deform and difficult-to-deform materials) in an alternating pattern within the wire assembly. This creates local variations in deformation behavior during ultrasonic bonding, ensuring that each conductor type contributes optimally to the bonding process. The alternating arrangement allows easy-to-deform conductors to bridge gaps and accommodate surface irregularities while difficult-to-deform conductors provide structural stability, resulting in consistent and strong bonds across the entire assembly.
Solution Approach 2:
The patent employs asymmetry in the material composition arrangement within the wire assembly. Rather than using symmetric or uniform material distribution, the invention deliberately creates an asymmetric structure where conductors of different materials are interspersed in a specific alternating pattern. This asymmetric arrangement optimizes the bonding interface by ensuring that conductors with complementary deformation properties are positioned adjacent to each other, allowing them to work together synergistically during the ultrasonic bonding process to overcome oxide film barriers and achieve reliable bonds.
2Strength
If ultrasonic bonding energy is increased to improve bonding strength, then bonding between difficult-to-deform conductors improves, but mold adhesion occurs and bonding quality deteriorates
Solution Approach 1:
The patent applies local quality by creating zones of different deformation characteristics within the conductor assembly through the alternating material arrangement. This local variation in material properties allows different regions of the assembly to respond differently to ultrasonic energy, distributing the bonding stress more evenly and preventing localized overheating or excessive deformation that would lead to mold adhesion, while still achieving sufficient bonding strength in each local region.
Solution Approach 2:
The patent changes the material composition parameters of the conductor assembly by interspersing conductors with different deformation characteristics. This parameter change fundamentally alters the bonding behavior during ultrasonic welding, allowing the assembly as a whole to achieve optimal bonding without requiring excessive energy input that would cause mold adhesion. The mixed-material structure modifies the effective deformation resistance and energy absorption characteristics of the entire assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement achieves stable and high bonding strength by ensuring uniform deformation and adhesion, reducing variations and enhancing the bond between conductors of different materials.
Implementation Method 1
a conductor-bonded structure in which conductors of a plurality of wires are ultrasonically bonded
Implementation Method 2
the conductors that are relatively easy to deform may be arranged between the conductors that are relatively difficult to deform
Data Source
Figure 1
Figure 2
Figure 3
AI summary
Provided is a bonded structure in which conductors of a plurality of wires is ultrasonically bonded together. Conductors (5a) that are relatively difficult to deform are intermixed with conductors (5b) that are relatively easy to deform. In other words, two or more types of the wires made up of conductors of different materials are intermixed. In an axial view of the wires, when an ultrasonic bonding direction is an up-down direction of a conductor joint, and a direction orthogonal to the ultrasonic bonding direction is a width direction of the conductor joint, the conductors (5a, 5b) of different materials are arranged substantially line symmetrical with respect to a center line (A) in the width direction.