Ultrasonic Defect Inspection Coordinate Correction
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Solution Overview
Problem
Current defect inspection devices face challenges in accurately identifying void defects in wafers due to coordinate deviations in ultrasonic images, which affect the precision of defect detection.
Innovation Solution
The device combines an ultrasonic probe and an infrared camera with a calculator and corrector to calculate and apply correction values for coordinate deviations in ultrasonic images, ensuring accurate alignment and detection of defects by using reference marks and simulated inspection objects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If ultrasonic images are used for defect inspection, then inspection capability is provided, but coordinate deviation reduces measurement precision
Solution Approach 1:
The patent introduces an infrared image as an intermediary to bridge the coordinate system discrepancy between the ultrasonic image and the actual wafer. The infrared image, obtained through infrared radiation and detection, provides accurate coordinate information that serves as a reference to correct the deviated coordinates in the ultrasonic image, thereby enabling precise defect location without directly modifying the ultrasonic detection process
Solution Approach 2:
The patent creates a coordinate correspondence by capturing the wafer surface through infrared radiation to generate an infrared image that copies the spatial information. This infrared image serves as a coordinate reference map that is then superimposed with the ultrasonic image, allowing the system to transfer accurate coordinate information from the infrared copy to correct the ultrasonic image coordinates
2Measurement precision
If coordinate correction is applied to improve defect detection accuracy, then measurement precision improves, but device complexity increases
Solution Approach 1:
The patent makes the infrared camera serve multiple functions: it not only provides visual imaging of the wafer surface but also generates the coordinate reference data needed for correcting ultrasonic image coordinates. By making the infrared imaging system multi-functional, the patent avoids adding a separate coordinate measurement device, thus reducing overall system complexity while achieving precise coordinate correction
Solution Approach 2:
The patent merges the infrared imaging function with the coordinate measurement function. Instead of using separate systems for imaging and coordinate reference, the infrared camera simultaneously performs both roles by capturing thermal radiation patterns that correspond to the wafer's physical features, thereby integrating multiple functions into a single device to reduce complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the accuracy of defect inspection by correcting for coordinate deviations, allowing for precise identification of common defects across semiconductor structures, improving the reliability of defect detection.
Implementation Method 1
radiate ultrasonic waves toward an inspection object for which inspection of defects is performed or a simulated inspection object that simulates the inspection object, receive ultrasonic waves reflected by the inspection object or the simulated inspection object
Implementation Method 2
convert the received ultrasonic waves to an electric signal to acquire an ultrasonic image
Implementation Method 3
radiate infrared rays toward a first region of the simulated inspection object or a second region of the inspection object, receive infrared rays reflected by or transmitted through the first or second region
Data Source
AI summary
A defect inspection device includes an ultrasonic probe, an image acquirer, a calculator, and a corrector. The ultrasonic probe acquires an ultrasonic image of an inspection object or a simulated inspection object. The image acquirer acquires an infrared image including a first region of the simulated inspection object or a second region of the inspection object. The calculator calculates a first correction value for correcting a coordinate deviation of the first region in the ultrasonic image and the infrared image with respect to a designed coordinate of the first region, or calculate a second correction value for correcting a coordinate deviation of the second region in the infrared image with respect to a designed coordinate of the second region. The corrector performs coordinate correction with the calculated first or second correction value for the ultrasonic image of the inspection object.