Ultrasonic Fluid Sensor Recessed Mounting for Acoustic Accuracy
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Solution Overview
Problem
Full-surface soldering of ultrasonic transducers on printed circuit boards leads to air pockets and defects, affecting acoustic properties and measurement accuracy, while adhesive bonding also results in inaccurate positioning and fluctuations in acoustic behavior.
Innovation Solution
The ultrasonic transducer is positioned on a printed circuit board with a recess that extends into its thickness, fastened via small areas, and surrounded by a housing that partially fits into the recess, reducing air pockets and improving measurement accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If full-surface soldering is used to connect the ultrasonic transducer to the printed circuit board, then electrical connection is achieved, but air pockets and defects form that disrupt acoustic properties and positioning accuracy
Solution Approach 1:
The patent divides the connection interface into discrete soldering points arranged in a grid pattern instead of full-surface soldering. This segmentation eliminates large air pockets and defects while maintaining electrical connection, thereby preserving acoustic properties and positioning accuracy of the ultrasonic transducer.
Solution Approach 2:
The patent applies different connection qualities to different regions: discrete soldering points provide electrical connection only where needed, while the majority of the transducer surface remains free of soldering material to maintain acoustic integrity. This local differentiation resolves the contradiction between electrical connection reliability and acoustic property preservation.
2Manufacturing precision
If adhesive bonding is used to fasten the ultrasonic transducer, then positioning is achieved, but fluctuations in acoustic behavior occur due to imperfect bonding
Solution Approach 1:
The patent uses discrete soldering points instead of continuous adhesive bonding, segmenting the connection interface to eliminate the formation of air pockets and defects that cause acoustic behavior fluctuations. This segmented approach provides stable acoustic properties while maintaining positioning accuracy.
3Reliability
If the ultrasonic transducer is soldered to the printed circuit board, then electrical connection is established, but the transducer floats and moves laterally during soldering, limiting positioning accuracy
Solution Approach 1:
The patent employs a positioning device that preliminarily fixes the ultrasonic transducer in the correct position before the soldering process begins. This preliminary action prevents lateral movement and floating during soldering, ensuring positioning accuracy is maintained while establishing reliable electrical connection through discrete soldering points.
4Reliability
If grid soldering points are used instead of areal soldering material, then acoustic properties are improved, but positioning accuracy deteriorates due to increased transducer movement
Solution Approach 1:
The patent combines grid soldering points with a positioning device that preliminarily secures the transducer in position. This preliminary action compensates for the reduced mechanical constraint of discrete soldering points, preventing lateral movement while maintaining the acoustic property benefits of segmented soldering.
Solution Approach 2:
The patent applies discrete soldering points at specific locations that provide both electrical connection and mechanical stabilization. This localized approach to soldering maintains acoustic properties by avoiding areal soldering material while ensuring sufficient positioning accuracy through strategically placed connection points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures precise positioning of the transducer, minimizes defects, and enhances acoustic properties by reducing scattering and decay time, leading to improved measurement accuracy.
Implementation Method 1
the sound transducer can be used to emit sound pulses or sound signals into the fluid to be measured. The sound pulses or sound signals can be reflected by a surface or boundary surface of the fluid to a further medium.
Implementation Method 2
The recess (130) is designed to receive the housing area (142) and thereby to reduce the formation of air pockets between the ultrasonic transducer (110) and the printed circuit board (120).
Data Source
AI summary
Various embodiments of the teachings herein include a fluid sensor apparatus for capturing a filling level and/or a quality of a fluid in a fluid container. The fluid sensor apparatus may include: a printed circuit board having a recess extending at least partially into the printed circuit board along a thickness and a fastening area; an ultrasonic transducer fitted to the fastening area so the ultrasonic transducer extends at least partially over the recess; and a housing at least partially surrounding the printed circuit board and the ultrasonic transducer so a portion of the housing area is arranged in the recess.