Ultrasonic Device Groove Pressure Equalization
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Solution Overview
Problem
Ultrasonic devices face performance degradation due to pressure differences and foreign substance infiltration, leading to potential breakage or deterioration of piezoelectric elements and vibration films, which compromises their reliability.
Innovation Solution
The ultrasonic device incorporates a substrate with groove portions that communicate with an external space through a hole portion, increasing the length of the groove portions to reduce pressure differences and enhance foreign substance resistance, thereby preventing performance degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the periphery of the piezoelectric element is sealed with a sealing plate, then foreign substance infiltration is suppressed, but pressure difference causes breakage or deterioration of the piezoelectric element or vibration film
Solution Approach 1:
The invention extracts the harmful pressure difference from the sealed internal space by introducing a communication path through the substrate. The through-hole and groove portions create a pressure equalization channel that connects the internal space to the external environment, allowing pressure to be released while maintaining the sealing plate's protective function against foreign substances.
Solution Approach 2:
The substrate acts as an intermediary structure that reconciles the conflicting requirements of sealing and pressure equalization. By forming communication paths (through-hole and groove portions) within the substrate itself, the invention enables pressure relief without compromising the sealing plate's ability to block foreign substances, thus mediating between the two opposing demands.
2Object-affected harmful factors
If the internal space is completely sealed, then foreign substances are blocked, but pressure difference cannot be relieved causing stress on components
Solution Approach 1:
The sealing plate maintains its sealing function at the periphery of the piezoelectric element, while the substrate provides localized pressure relief paths through the through-hole and groove portions. This local differentiation allows the system to simultaneously achieve foreign substance blockage at the sealing interface and pressure equalization through the substrate's communication paths.
Solution Approach 2:
The invention segments the sealing function from the pressure management function. The sealing plate handles foreign substance blockage, while the substrate's through-hole and groove portions handle pressure equalization. This segmentation allows each component to optimize its specific function without compromising the other.
3Object-affected harmful factors
If groove portions are extended to increase foreign substance resistance, then infiltration is suppressed, but device complexity increases
Solution Approach 1:
The invention merges the pressure equalization function and foreign substance resistance function into a single integrated substrate structure. The through-hole and groove portions work together as a unified communication path system that simultaneously manages pressure differential and resists foreign substance infiltration, eliminating the need for separate components and reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses pressure differences and foreign substance infiltration, improving the reliability and longevity of the ultrasonic device by maintaining the integrity of the piezoelectric elements and vibration films.
Implementation Method 1
a piezoelectric element provided on the vibration film on the side opposite to the opening
Implementation Method 2
the ultrasonic device detects an electric signal that is output from the piezoelectric element in response to the vibration of the vibration film due to ultrasonic waves incident thereon
Data Source
AI summary
An ultrasonic device includes: a substrate including a first groove portion and a second groove portion in a first surface; a vibration film provided on the first surface and closing the first groove portion and the second groove portion; a first piezoelectric element provided on the vibration film and overlapping the first groove portion in a plan view as viewed in a thickness direction of the substrate; and a second piezoelectric element provided on the vibration film and overlapping the second groove portion in the plan view. The substrate is provided with a third groove portion coupling the first groove portion to the second groove portion. The substrate is provided with a fourth groove portion extending in a direction away from the first piezoelectric element and the second piezoelectric element in the plan view and coupled to the third groove portion. A hole portion coupling a second surface of the substrate that is opposed to the first surface to the fourth groove portion is provided.