Ultrasonic Fingerprint IC Card Structure for Hole-Free Lamination
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Solution Overview
Problem
IC cards with capacitive fingerprint sensors require a direct contact detection surface, necessitating a hole in the card and precise alignment, complicating manufacturing and constraining design flexibility.
Innovation Solution
The IC card employs an ultrasonic fingerprint sensor that allows fingerprint detection through plastic and glass, eliminating the need for a surface exposure and simplifying the manufacturing process by integrating the sensor within the card structure without a through-hole, using a combination of resin layers and a frame to secure the internal components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional IC card manufacturing process is used, then mass production is achieved, but manufacturing precision deteriorates due to misalignment of the lamination structure
Solution Approach 1:
The patent applies preliminary action by pre-forming recessed portions and protruding portions on the IC chip before lamination. These pre-formed structural features serve as alignment guides that ensure precise positioning during the lamination process, thereby maintaining manufacturing precision while enabling mass production.
Solution Approach 2:
The patent introduces an intermediary alignment mechanism through the recessed portion of the IC chip and the corresponding protruding portion of the insulating substrate. This intermediary structural feature acts as a mechanical guide that facilitates precise alignment during lamination, resolving the contradiction between production speed and alignment precision.
2Ease of manufacture
If the IC chip is mounted on the insulating substrate, then the IC card structure is formed, but air pockets remain trapped causing reliability issues
Solution Approach 1:
The patent applies preliminary action by pre-forming the recessed portion on the IC chip surface before mounting. This recessed structure creates a cavity that allows air to escape during the lamination process, preventing air pockets from being trapped between the IC chip and insulating substrate, thereby improving reliability while maintaining ease of manufacture.
3Ease of manufacture
If the IC chip surface is flat, then manufacturing is simple, but resin does not adhere properly causing durability issues
Solution Approach 1:
The patent applies local quality by creating a recessed portion at a specific location on the IC chip surface rather than modifying the entire surface. This localized structural change provides both mechanical interlocking and increased surface area for resin adhesion, thereby improving bond strength while maintaining simplicity in the overall manufacturing process.
4Ease of manufacture
If the IC card has a thick structure, then component placement is easier, but portability deteriorates due to increased weight and size
Solution Approach 1:
The patent applies the nesting principle by placing the IC chip within a recessed portion of the insulating substrate, effectively embedding it. This nested arrangement allows the IC card to maintain a thin overall profile while still providing adequate space for proper component placement and connection, thereby improving portability without compromising manufacturability.
Data Source
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AI summary
The present invention provides an IC card provided with an IC chip, and configured to enable at least one of contact communication and contactless communication, the IC card including an ultrasonic fingerprint sensor connected to the IC chip and a storage unit in which fingerprint data for matching is stored. An outer surface of the IC card is formed of synthetic resin, and the ultrasonic fingerprint sensor is covered with the synthetic resin.