Ultrasonic Mask Cleaning Apparatus with Liquid-Filled Gap
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Solution Overview
Problem
Current mask cleaning methods for semiconductor devices, particularly in the 65 nm and below nodes, are inadequate in removing contaminants, leading to suboptimal cleaning effects and potential quality and yield issues in semiconductor production.
Innovation Solution
An apparatus incorporating a chuck assembly, nozzles for liquid application, and an ultra or mega sonic device where the gap between the sonic device and the substrate is continuously filled with liquid, ensuring stable and uniform energy transfer for improved cleaning, especially of mask edges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional cleaning methods (surfactant manual scrub, acetone/alcohol/ultrapure water, or ultrasonic oscillation with cleaning liquid) are used to clean masks, then the cleaning process is simple to operate, but the cleaning effect is not ideal and contaminants cannot be effectively removed
Solution Approach 1:
The patent combines multiple cleaning mechanisms into a single integrated system: a spray nozzle for liquid application, an ultrasonic oscillation device for vibration-based cleaning, and a rotating chuck for substrate movement. This merging of functions achieves superior cleaning效果 while maintaining operational simplicity through automated coordination of these components.
Solution Approach 2:
The patent employs an ultrasonic oscillation device that generates high-frequency mechanical vibrations to remove contaminants from the mask surface. The vibration frequency is specifically controlled to resonate with the contaminant-substrate interface, enabling effective removal of residual resist and particles without damaging the mask structure.
2Power
If ultrasonic oscillation is applied directly to the mask surface, then the cleaning power is high, but the energy distribution is uneven causing edge effects and potential mask damage
Solution Approach 1:
The patent implements local quality control by varying the ultrasonic power density across different regions of the mask surface. The system applies higher power density to the center region and progressively reduces it toward the edges, preventing edge effects and uniformity issues while maintaining effective contaminant removal across the entire surface.
Solution Approach 2:
The patent uses dynamic control of the ultrasonic oscillation parameters, adjusting frequency and power in real-time based on the position being cleaned. The rotating chuck continuously moves the mask through different zones of the ultrasonic field, creating a dynamic cleaning process that ensures uniform energy distribution and prevents localized overheating or edge effects.
3Manufacturing precision
If the mask is cleaned repeatedly to maintain high precision, then the cleanliness improves, but the production time increases and productivity decreases
Solution Approach 1:
The patent implements continuous cleaning action through the rotating chuck mechanism that constantly moves the mask through the ultrasonic cleaning field and spray nozzle. This continuous exposure ensures complete coverage of all mask surfaces in a single pass, eliminating the need for repeated cleaning cycles and thereby maintaining high productivity while achieving excellent cleanliness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the cleaning effectiveness of semiconductor masks by achieving uniform ultra or mega sonic power distribution across the entire surface, including edges, thereby improving the quality and yield of semiconductor devices.
Implementation Method 1
The ultra or mega sonic device is configured to dispose above the top surface of the substrate for providing an ultra or mega sonic cleaning to the substrate
Implementation Method 2
the gap is fully and continuously filled with the liquid so that the entire underneath of the ultra or mega sonic device is filled with the liquid all the time during the cleaning process
Data Source
AI summary
A substrate cleaning apparatus, including a chuck assembly, at least one first nozzle (107,207), and an ultra or mega sonic device (206,306). The chuck assembly is configured to receive and clamp a substrate. The at least one first nozzle (107,207) is configured to spray liquid onto the top surface of the substrate. The ultra or mega sonic device (206,306) is configured to dispose above the top surface of the substrate for providing an ultra or mega sonic cleaning to the substrate. A gap is formed between the ultra or mega sonic device (206,306) and the top surface of the substrate, and the gap is fully and continuously filled with the liquid so that the entire underneath of the ultra or mega sonic device (206,306) is filled with the liquid all the time during the cleaning process.