Ultrasonic Device Nested Array Counter Plate Rigidity
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Solution Overview
Problem
Existing ultrasonic probes face challenges in reducing size while maintaining rigidity due to the thickness of the sealing plate, which can deform or break under stress, limiting the reduction of the ultrasonic module's size.
Innovation Solution
The ultrasonic device incorporates an element substrate with an ultrasonic transducer array, an array counter plate, and a support substrate with an insertion section, allowing the array counter plate to be inserted into the support substrate, reducing the thickness and size of the device without compromising rigidity, and using a fixing member like resin to secure the array counter plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness dimension of the sealing plate is reduced to suppress the increase in size of the ultrasonic probe, then the size of the ultrasonic module is reduced, but the rigidity of the sealing plate decreases causing stress to deform or break the sealing plate and diaphragm
Solution Approach 1:
The array counter plate is inserted into the support substrate, creating a nested structure where one component fits within another. This nesting arrangement reduces the overall thickness dimension of the ultrasonic device while the support substrate provides structural reinforcement to maintain rigidity of the array counter plate, thereby resolving the contradiction between size reduction and rigidity maintenance.
Solution Approach 2:
The invention uses a composite structure combining the array counter plate and support substrate, where the support substrate acts as a reinforcing element. This composite arrangement allows the device to achieve both compact size (through insertion) and desired rigidity (through the supporting structure), preventing the sealing plate and diaphragm from deforming or breaking under stress.
2Volume of moving object
If the thickness dimension of the sealing plate is reduced, then the size of the ultrasonic module is reduced, but stress produced when the ultrasonic probe is brought into contact with a measurement target could deform or break the sealing plate and diaphragm
Solution Approach 1:
The nested configuration of the array counter plate within the support substrate reduces overall device size while the support substrate provides structural backing that prevents deformation and breakage of the array counter plate and diaphragm under measurement stress, thereby maintaining reliability.
Solution Approach 2:
The support substrate acts as an intermediary structural element between the measurement target contact point and the array counter plate. It mediates the stress distribution, preventing direct transmission of harmful stresses to the array counter plate and diaphragm, thus maintaining reliability while enabling compact size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a compact ultrasonic device with desired rigidity and size reduction, preventing deformation and breakage of the element substrate during use, and allows for improved positioning and manufacturing efficiency.
Implementation Method 1
a drive layer that serves as an electromechanical conversion element
Implementation Method 2
a fixing member that fixes the array counter plate to the support substrate
Data Source
AI summary
An ultrasonic device includes an element substrate provided with an ultrasonic transducer array in which a plurality of ultrasonic transducers are arranged in an array, a sealing plate (array counter plate) that is bonded to the element substrate and covers at least the ultrasonic transducer array, and a support substrate that supports at least one of the element substrate and the sealing plate, and the support substrate has a through hole (insertion section) into which at least part of the sealing plate is inserted.