Ultrasonic Transducer Package With Integrated Cable Interface
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Solution Overview
Problem
There is a challenge in ensuring a good acoustic connection between ultrasonic sensors and their surrounding systems, requiring an improved electrical connection that is simple and flexible for ultrasonic sensors.
Innovation Solution
A semiconductor package with a housing containing a micromechanical ultrasonic transducer and a cable interface that can be separably connected to a plug connector, allowing for external electrical contact, enabling flexible and simple installation of cables for ultrasonic transducers, and potentially integrating into small systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a cable interface is integrated into the housing of the semiconductor package, then the electrical connection becomes more flexible and simple to install, but the device complexity increases
Solution Approach 1:
The cable interface is merged with the housing structure, integrating the electrical connection component directly into the package housing. This allows the housing to serve dual functions: protecting the transducer and providing an integrated electrical interface for cable connection, thereby simplifying installation while managing complexity through functional integration.
Solution Approach 2:
The housing is designed to serve multiple functions: it protects the ultrasonic transducer, provides acoustic coupling, and integrates the cable interface for electrical connection. This multi-functionality reduces the need for separate components, simplifying the overall system while maintaining ease of cable installation.
2Adaptability or versatility
If the semiconductor package is designed for separable cable connection, then the adaptability and flexibility improve, but the manufacturing complexity increases
Solution Approach 1:
The electrical connection is segmented into separable components: the cable interface integrated into the housing and the plug connector on the cable. This segmentation allows flexible assembly and disassembly while maintaining standardized manufacturing processes for each component, balancing adaptability with manufacturability.
Solution Approach 2:
The cable interface is pre-integrated into the housing during package manufacturing, preparing the structure for subsequent cable attachment. This preliminary action simplifies the final assembly step and allows for standardized production of the housing component, reducing overall manufacturing complexity despite the separable design.
Data Source
AI summary
A semiconductor package is proposed. The semiconductor package includes a housing and at least one micromechanical ultrasonic transducer arranged in the housing. Furthermore, the semiconductor package includes a cable interface integrated into the housing, which is configured to be separably connected to a plug connector in order to electrically contact the semiconductor package externally.