Ultrasonic Component Packaging Structure for Short-Distance Sensing
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Solution Overview
Problem
Existing ultrasonic modules face insensitivity in short-distance sensing due to circuit board resonance and vibration caused by ultrasonic signals and reflected waves, leading to reduced sensitivity.
Innovation Solution
The ultrasonic component packaging structure includes a substrate, ultrasonic component, pins, and a protective shell, with the ultrasonic component exposed through an opening in the shell, allowing pins to connect to a circuit board without direct contact, reducing vibration transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the ultrasonic module is designed with a flat planar structure, then the device can be attached to a circuit board in a compact manner, but the sensitivity for short-distance sensing deteriorates due to circuit board resonance and vibration
Solution Approach 1:
The ultrasonic module is divided into independent ultrasonic components (transmitters and receivers) that are mounted on the substrate rather than directly integrating the entire module onto the circuit board. This segmentation allows the ultrasonic elements to be positioned optimally for short-distance sensing while maintaining a compact overall form factor.
Solution Approach 2:
The patent transitions from a purely planar two-dimensional mounting approach to a three-dimensional configuration where ultrasonic components are elevated above the substrate plane. This vertical dimensioning reduces the impact of circuit board vibrations on the ultrasonic elements, improving short-distance sensing sensitivity while maintaining compact footprint.
2Device complexity
If the ultrasonic component is directly mounted on the circuit board, then the device complexity is reduced, but harmful vibrations and resonance from the circuit board interfere with sensing accuracy
Solution Approach 1:
A substrate is introduced as an intermediary component between the circuit board and the ultrasonic components. This substrate serves as a mechanical isolation layer that reduces the transmission of harmful vibrations and resonance from the circuit board to the ultrasonic elements, thereby improving sensing accuracy without significantly increasing device complexity.
Solution Approach 2:
The ultrasonic components are extracted from direct contact with the circuit board and mounted on the substrate instead. This separation removes the source of vibration interference from the sensitive ultrasonic sensing elements, reducing harmful mechanical coupling while maintaining a relatively simple overall structure.
3Measurement precision
If the ultrasonic component is exposed through a protective shell with openings, then sensing accuracy is improved by reducing vibration transmission, but the device complexity increases due to additional packaging structure
Solution Approach 1:
The protective shell is designed with localized openings only at the positions where ultrasonic components require exposure for sensing. This selective exposure approach provides vibration isolation where needed while maintaining structural integrity and simplicity in other areas, balancing sensing accuracy improvement with minimal increase in overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively alleviates circuit board vibration, enhances sensitivity for short-distance sensing, and improves sensing accuracy by minimizing interference.
Implementation Method 1
An ultrasonic module usually includes a pair of an ultrasonic transmission assembly and an ultrasonic receiving assembly, which are used to transmit an ultrasonic signal and receive a reflected wave
Implementation Method 2
the ultrasonic component packaging structure includes a substrate, an ultrasonic component, a first pin, a second pin, and a protective shell... effectively alleviates circuit board vibration, enhances sensitivity for short-distance sensing
Data Source
AI summary
An ultrasonic component packaging structure includes a substrate, an ultrasonic component, a first pin, a second pin, and a protective shell. The substrate includes a first connection pad and a second connection pad. The ultrasonic component includes a first electrode and a second electrode that are electrically connected to the first connection pad and the second connection pad respectively. The first pin and the second pin are electrically connected to the first connection pad and the second connection pad respectively, and extend in an opposite direction of the ultrasonic component. The protective shell surrounds the substrate and the ultrasonic component, and is provided with a first opening to expose the ultrasonic component. Based on the design of the pins, the ultrasonic component can be fixed in a plugging manner, so that interference between ultrasonic components can be avoided, and a sensing distance can be effectively shortened.