Ultrasonic Probe Heat Dissipation via Attenuation Material
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Solution Overview
Problem
Conventional ultrasonic probes face challenges in reducing noise generated by natural vibration frequencies and higher harmonic waves during heat dissipation without compromising heat dissipation effectiveness, as existing solutions either suppress sensitivity or fail to provide sufficient heat dissipation.
Innovation Solution
An ultrasonic probe design incorporating an acoustic element, a support, and a heat dissipation material with an attenuation/thermal conduction material made of a thermally conductive material, which effectively attenuates ultrasonic waves and facilitates heat transfer without hindering heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a back load material is used to attenuate ultrasonic waves, then heat generation temperature is reduced, but ultrasonic waves that cannot be completely attenuated are transmitted to the heat transfer member causing noise
Solution Approach 1:
The patent divides the heat dissipation function into multiple segments: the back load material for ultrasonic attenuation, the heat transfer member for heat conduction, and the vibration damping member for noise reduction. This segmentation allows each component to specialize in one function, preventing the heat transfer member from becoming a source of noise while maintaining effective heat dissipation.
Solution Approach 2:
The vibration damping member acts as an intermediary between the heat transfer member and the piezoelectric element. It absorbs the harmful vibrations generated by the heat transfer member during heat dissipation, preventing these vibrations from being transmitted back to the piezoelectric element and converted into noise signals.
2Object-generated harmful factors
If a sound absorbing member is disposed between heat dissipation members to reduce noise, then noise is reduced, but heat transfer is suppressed and sufficient heat dissipation cannot be obtained
Solution Approach 1:
The vibration damping member serves as a specialized intermediary that selectively damps vibrations while maintaining thermal contact. Unlike general sound absorbing materials that block both sound and heat, this intermediary component is designed to absorb mechanical vibrations generated during heat transfer while allowing thermal energy to pass through, thus resolving the contradiction between noise reduction and heat dissipation efficiency.
Solution Approach 2:
The vibration damping member is strategically positioned only at the critical interface where vibrations are generated and transmitted to the piezoelectric element. This localized application of vibration damping properties ensures noise reduction at the problem source while minimizing interference with the overall heat dissipation pathway.
3Temperature
If drive voltage is suppressed to satisfy heat restriction, then living body contact portion temperature is controlled, but sensitivity of the ultrasonic probe is lowered
Solution Approach 1:
The patent extracts the heat dissipation function from the living body contact portion by providing a dedicated heat dissipation pathway through the back load material and heat transfer member. This allows the piezoelectric element to operate at higher drive voltages for improved sensitivity while the generated heat is efficiently removed through the back side, preventing temperature rise at the living body contact portion.
Solution Approach 2:
The patent addresses the heat management problem by transitioning from one-dimensional heat management (restricting drive voltage to control temperature) to two-dimensional heat management (allowing high drive voltage for sensitivity while providing an alternative heat dissipation pathway through the back side of the piezoelectric element). This dimensional change in heat management strategy resolves the contradiction between sensitivity and temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed design effectively reduces noise from natural vibration frequencies and higher harmonic waves while ensuring efficient heat dissipation, maintaining sensitivity and heat transfer efficiency.
Implementation Method 1
an attenuation/thermal conduction material made of an attenuating material containing a thermally conductive material is disposed in contact with the heat dissipation material
Implementation Method 2
an attenuation/thermal conduction material made of an attenuating material containing a thermally conductive material
Data Source
AI summary
An ultrasonic probe includes: an acoustic element that generates an ultrasonic wave and detects the ultrasonic wave; a support that supports the acoustic element on a side opposite to a test object side; and a heat dissipation material disposed on a side of the support opposite to the acoustic element, wherein an attenuation/thermal conduction material made of an attenuating material containing a thermally conductive material is disposed in contact with the heat dissipation material.