Ultrasonic Probe Backing Case Heat Dissipation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Body cavity insertion type ultrasonic probes face challenges in firmly fixing the inner unit and achieving effective heat dissipation, particularly due to the soft nature of the backing material and inadequate heat dissipation in existing structures.

Innovation Solution

The ultrasonic probe incorporates a backing case that surrounds and holds the backing member, providing structural rigidity and acting as a heat conduit, with a heat conductive sheet connecting the electronic circuit board to the backing case for efficient heat dissipation, while maintaining ultrasound entry.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the backing member is held directly by the probe head case, then the structure is simple, but the fixation is unreliable due to the soft nature of the backing material

Engineering Contradiction:

Improvestructure simplicityVSAvoidfixation reliability

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

A backing case is introduced as an intermediary component between the probe head case and the backing member. The backing case serves as a rigid holder that surrounds and secures the soft backing member, enabling reliable fixation without directly contacting the backing material. This mediator transfers the mechanical support function from the probe head case to a dedicated structural component.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The backing case is designed as a rigid housing structure that surrounds the backing member. This case provides mechanical support and fixation points for the soft backing material, effectively converting the problem of soft material fixation into a rigid container design issue.

Inventive Principle:

Principle #30Flexible shells and thin films

2Loss of energy

If heat is conducted from the electronic circuit board to the array transducer, then heat dissipation is achieved, but the array transducer temperature increases causing degradation

Engineering Contradiction:

Improveheat dissipationVSAvoidarray transducer temperature

Core Design Contradiction:

Loss of energyVSTemperature

Solution Approach 1:

The heat dissipation function is extracted from the array transducer assembly and redirected to a dedicated heat sink component. The electronic circuit board is positioned to conduct heat away from the array transducer toward the heat sink, separating the thermal management function from the ultrasound transmission function.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The heat generated by the electronic circuit board, which would otherwise cause temperature rise and degradation, is converted into a beneficial cooling effect for the array transducer. The heat sink acts as a thermal conduit that directs excess heat away from sensitive components, transforming a harmful thermal effect into a controlled heat dissipation process.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Loss of energy

If a heat sink is connected to the electronic circuit board with the backing therebetween, then heat dissipation is attempted, but sufficient heat dissipation cannot be achieved

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidheat dissipation structure

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The heat dissipation function is extracted from the backing member and assigned to a dedicated heat sink component. This separation allows the backing member to fulfill its acoustic function while the heat sink handles thermal management independently, improving heat dissipation efficiency without compromising the acoustic performance.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The heat sink serves as a specialized intermediary component for thermal management. It is positioned between the electronic circuit board and the array transducer, acting as a thermal conduit that directs heat away from sensitive components while maintaining the acoustic integrity of the backing member.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration ensures stable fixation of the inner unit and effective heat dissipation, preventing temperature increases in the array transducer and transmission/reception surface, thereby enhancing the probe's performance and reliability.

Implementation Method 1

a backing member that is provided on a side of a back surface of the array transducer and that attenuates ultrasound

Methodology Applied

Scientific EffectAcoustic absorption: Acoustic Absorption

Implementation Method 2

a heat conductive sheet connecting the electronic circuit board to the backing case for efficient heat dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9820720B2Ultrasonic probe

Publication Date: 2017.11.21 FUJIFILM CORP

AI summary

A body-cavity-insertion-type probe wherein an internal unit (internal assembly) has an oscillator unit, a relay board, and electronic circuit board, and a backing member. The backing member is retained in a state of being housed inside a backing case, and the backing case is retained by two recesses formed in an inside surface of a heat dissipation shell as a probe head case. An exhaust heat sheet is joined to a peripheral region of a back surface of the electronic circuit board. A rear wing and a front wing of the exhaust heat sheet are joined to the backing case.