Ultrasonic Probe Backing Layer Segmentation for Reliable Electrical Connections
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Solution Overview
Problem
The manufacturing of two-dimensional ultrasonic transducer arrays for ultrasonic diagnostic apparatuses is complicated by the need to draw and manage thousands of electrode lead wires, which are prone to tangling within the narrow space of the piezo-electric layers, making it difficult to achieve a reliable and efficient electrical connection.
Innovation Solution
The use of backing elements with conductive traces formed on their surfaces, arranged in either one-dimensional or two-dimensional configurations, to electrically and acoustically connect with ultrasonic transducer elements, simplifying the connection process and improving the electrical characteristics by increasing the thickness and coverage of conductive traces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thousands of electrode lead wires are drawn from each ultrasonic transducer element in a two-dimensional array, then electrical connection is achieved, but the lead wires become tangled and circuit configuration becomes complicated
Solution Approach 1:
The patent segments the continuous acoustic absorption layer into multiple discrete acoustic absorption members arranged in a matrix pattern. Each member corresponds to a specific ultrasonic transducer element and contains integrated electrode lead wires. This segmentation allows the lead wires to be organized and routed separately for each transducer element, preventing tangling and simplifying the overall circuit configuration while maintaining reliable electrical connections.
Solution Approach 2:
The patent combines the electrode lead wires with the acoustic absorption members by integrating the lead wires into the structure of each acoustic absorption member. This merging allows the electrical connection function and the acoustic absorption function to be combined in a single component, reducing the number of separate elements and simplifying the overall device structure.
2Reliability
If acoustic absorption members are arranged in a two-dimensional matrix, then coverage and electrical connection are improved, but manufacturing complexity increases
Solution Approach 1:
The patent incorporates the electrode lead wires into the acoustic absorption members during the manufacturing process itself, rather than adding them separately afterward. This preliminary action of integrating the electrical connection structure into the acoustic absorption members during fabrication simplifies the overall manufacturing process by reducing the number of assembly steps required.
Solution Approach 2:
The acoustic absorption members serve multiple functions: they provide acoustic absorption to prevent ultrasonic wave reflection, and they simultaneously serve as the structural carrier for the electrode lead wires. This multi-functionality reduces the total number of components needed and simplifies the manufacturing process by combining what would otherwise be separate manufacturing operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the connection process, reduces the complexity of the circuit configuration, and enhances the electrical characteristics, leading to improved performance and reduced image distortion by effectively managing the ultrasonic wave absorption and transmission.
Implementation Method 1
a piezo-electric layer configured to reciprocally change an electrical signal and an acoustic signal while a piezo-electric material is vibrated
Implementation Method 2
a transducer module having an acoustic absorption layer, that is, a backing layer, that prevents an image distortion by blocking the ultrasonic wave from proceeding toward a rear of the piezo-electric layer
Data Source
Figure 1(A)~1(b)
Figure 2
Figure 3
AI summary
A backing layer of a ultrasonic probe includes a plurality of members each having a shape of a polygonal column in a one-dimensional manner or in a two-dimensional manner. Each of the plurality of members is provided with a conductive trace disposed at one side surface thereof, thereby electrically connecting an ultrasonic transducer array, which is being acoustically connected to the backing layer, in a further simple and definite manner.