Ultrasonic Probe Cable with Fluid Cooling Loop
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Solution Overview
Problem
Current ultrasound probes face challenges in effectively dissipating heat generated by the microbeamformer ASIC, leading to performance compromises due to limited thermal conductivity in acoustic backing blocks and cable components, which restricts efficient heat dissipation.
Innovation Solution
A fluid-based closed loop active cooling system is integrated into the probe cable, where a heat exchanger in thermal communication with a thermally conductive backing block pumps a fluid through conduits in the cable for efficient heat dissipation via radiation and convection, and additional cooling is provided by metal-to-metal contact between the probe connector and the ultrasound system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermally conductive backing block is used to conduct heat away from the ASIC, then thermal conductivity is improved, but acoustic attenuation capability deteriorates
Solution Approach 1:
The backing block is constructed as a composite material combining graphite (providing thermal conductivity) with acoustic damping particles or structures (providing acoustic attenuation). This allows simultaneous achievement of both thermal conduction and acoustic damping functions that would be contradictory in a single homogeneous material.
Solution Approach 2:
The backing block is segmented into multiple layers or regions with different material properties - some regions optimized for thermal conduction while others optimized for acoustic attenuation. This segmentation allows each region to perform its specific function effectively without compromising the other.
2Temperature
If passive cooling elements are used to dissipate heat from the probe, then heat dissipation is improved, but probe performance deteriorates due to thermal limits
Solution Approach 1:
A thermally conductive cable is introduced as an intermediary element between the probe and the external environment. This cable acts as an extended heat dissipation pathway, carrying heat away from the probe to distant heat sinks or dissipative surfaces, thereby overcoming the thermal limits of passive cooling elements confined to the probe structure itself.
Solution Approach 2:
The heat dissipation pathway is extended from the two-dimensional probe structure into the three-dimensional space along the cable length. This dimensional extension provides additional surface area and volume for heat dissipation, allowing the system to reject heat more effectively without increasing the probe's own thermal mass or complexity.
3Device complexity
If the number of signal conductors is reduced by performing beamforming in the probe, then cable complexity is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The cable is designed to serve multiple functions simultaneously: it provides electrical signal transmission (with reduced conductor count for simplicity) and acts as a thermally conductive pathway for heat dissipation. The cable structure incorporates thermally conductive materials and design features that enable it to perform both electrical and thermal functions without requiring separate dedicated components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages lens face and probe handle temperatures by significantly enhancing heat dissipation capacity, preventing thermal build-up and maintaining probe performance.
Implementation Method 1
a heat exchanger in thermal communication with a thermally conductive backing block thermally coupled to the probe ASICs
Implementation Method 2
pumps a fluid through conduits in the cable for efficient heat dissipation via radiation and convection
Implementation Method 3
efficient heat dissipation via radiation and convection
Implementation Method 4
efficient heat dissipation via radiation and convection
Implementation Method 5
additional cooling is provided by metal-to-metal contact between the probe connector and the ultrasound system
Data Source
Figure 1
Figure 2
Figure 3~5
AI summary
A matrix array probe including a transducer array and integrated circuitry coupled to the transducer elements dissipates heat generated by the array and integrated circuitry through the cover of the transducer probe. A pump in the probe connector pumps fluid through a closed loop system including inbound an outbound fluid conduits in the cable. The fluid conduits in the cable are separated by the cable electrical conductors for the probe. The heat transfer in the probe is done by a heat exchanger in the probe spaceframe or transducer stack backing block and may use a Peltier device. Additional cooling may be provided by metal to metal contact with a chiller in the ultrasound system.