Ultrasonic Probe Common Electrode Dicing Protection
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Solution Overview
Problem
The existing manufacturing methods for ultrasound probes result in exposed ground electrode layers being damaged during dicing, leading to potential degradation in sensitivity due to the lack of protection from acoustic matching layers.
Innovation Solution
The formation of a commonization conductive part with a single-layer or multi-layer structure that electrically connects multiple piezoelectric elements, using conductive fillers to create a common electrode, which is protected during dicing by being covered by acoustic matching layers, thereby preventing damage and maintaining sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the ground electrode layer is exposed without being covered by the acoustic matching layer to enable connection to the common connection lead, then the connection is enabled, but the exposed portion is damaged during dicing causing sensitivity degradation
Solution Approach 1:
The patent applies preliminary action by forming the common connection lead structure before the dicing process. The ground electrode layer is intentionally designed to extend beyond the acoustic matching layer boundaries in advance, so that when dicing occurs, the exposed portions can be properly connected to the common connection lead without damage. This pre-planned configuration ensures both connection capability and prevents sensitivity degradation.
2Speed
If the arrangement pitch between piezoelectric elements is decreased to suppress grating noise, then the ultrasound frequency is improved, but the manufacturing precision requirement increases due to narrower element width
Solution Approach 1:
The patent merges multiple piezoelectric element structures into a single integrated unit with a common ground electrode layer and common connection lead. By combining the manufacturing process into one unified structure rather than individually processing each narrow element, the manufacturing precision requirement is relaxed while still achieving the desired narrow arrangement pitch for high-frequency ultrasound operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures the protection of piezoelectric elements during the dicing process, preventing sensitivity degradation and allowing for the formation of a high-sensitive ultrasound probe with improved signal-to-noise ratio and resolution.
Implementation Method 1
a piezoelectric body part 21 made of a piezoelectric material
Implementation Method 2
acoustic matching parts 3 respectively joined to the second conductive parts 23
Data Source
Figure 1~2
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Figure 6~7
AI summary
Provided are an ultrasound probe including high-sensitive piezoelectric elements and a method of manufacturing an ultrasound probe. The ultrasound probe includes a plurality of piezoelectric elements on a backing material arranged in an array along an arrangement direction. Each of the plurality of piezoelectric elements includes a laminate in which a first conductive part, a piezoelectric body part, and a second conductive part are laminated on a surface of the backing material in order. A plurality of acoustic matching part respectively arranged on the second conductive parts of the plurality of piezoelectric elements is provided. A plurality of third conductive parts acquired by respectively joining a part of the plurality of acoustic matching parts in an elevation direction to the second conductive parts of the plurality of piezoelectric elements is provided. A fourth conductive part that electrically connects the plurality of third conductive parts to each other is provided. The second conductive parts of the plurality of piezoelectric elements, the plurality of third conductive parts, and the fourth conductive part form a common electrode common to the plurality of piezoelectric elements.