Ultrasonic Probe Connector Bonding to Backing Members
Solution Overview
Problem
The existing ultrasonic diagnostic apparatus probes face challenges in manufacturing due to laborious and error-prone connections between the piezoelectric layer and the printed circuit board, leading to performance deterioration and non-uniformity.
Innovation Solution
The proposed solution involves a probe design with a backing layer, first and second connectors, and electrode layers, where the piezoelectric member is electrically connected to the connectors via these layers, eliminating the need for complex soldering and enhancing durability and uniformity, using flexible printed circuit boards and conductive materials for efficient signal transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wiring electrodes of PCB are connected to electrodes of piezoelectric layer through laborious manual operation, then signal transfer is achieved, but fabrication time increases and connection durability deteriorates
Solution Approach 1:
The patent merges the connector structure with the backing layer by bonding the connector to the backing layer, creating an integrated assembly. The wiring electrodes of the PCB are then connected to the electrodes of the piezoelectric layer through this integrated connector-backing layer structure, eliminating manual operations and improving both connection durability and fabrication efficiency.
Solution Approach 2:
The connector serves as an intermediary component between the PCB and the piezoelectric layer. It provides a standardized interface with wiring electrodes that facilitate reliable electrical connection, replacing direct manual bonding and ensuring consistent connection quality across all assemblies.
2Reliability
If manual connection operation is used to connect PCB wiring electrodes to piezoelectric layer electrodes, then electrical connection is established, but non-uniformity of connected part increases
Solution Approach 1:
The connection system is segmented into distinct functional components: the PCB with its wiring electrodes, the connector with bonding electrodes, and the piezoelectric layer with its electrodes. This segmentation allows each component to be optimized independently and connected through standardized interfaces, ensuring uniformity while simplifying the overall connection process.
Solution Approach 2:
The patent changes the connection method from manual variable-parameter bonding to a standardized process with fixed parameters. The connector provides consistent electrode positioning, bonding surface area, and electrical characteristics, eliminating non-uniformity caused by manual operation variations.
3Reliability
If complex soldering process is used to connect piezoelectric layer to PCB, then durable connection is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent replaces the complex mechanical soldering process with a simplified bonding connection. The connector's wiring electrodes are bonded to the piezoelectric layer electrodes through the backing layer using bonding electrodes, eliminating the need for soldering while maintaining connection durability and significantly simplifying the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the manufacturing process, reduces performance degradation, and ensures consistent connections, leading to improved probe durability and reduced noise, while allowing for easier assembly and cost-effective production with enhanced uniformity of products.
Implementation Method 1
a piezoelectric layer in which a piezoelectric material converts electrical signals into sound signals or vice versa while vibrating
Implementation Method 2
a sound matching layer reducing a difference in sound impedance between the piezoelectric layer and a patient body to allow as much of the ultrasound waves generated from the piezoelectric layer as possible to be transferred to the patient body
Implementation Method 3
a lens layer focusing the ultrasound waves, which travel in front of the piezoelectric layer, onto a predetermined point
Implementation Method 4
a backing layer blocking the ultrasound waves from traveling in a rearward direction of the piezoelectric layer to prevent image distortion
Data Source
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AI summary
A probe for an ultrasonic diagnostic apparatus includes (110) including backing members (111, 112, 113), a first connector (120) bonded between the backing members (111, 112) and including electrodes (125) spaced from each other in an arrangement direction, a ground connector (130) bonded between the backing members (112, 113) to be spaced from the first connector (120), and a piezoelectric member (160) electrically connected to the electrodes (125) and the ground connector (130). A method of manufacturing the same is also disclosed. The piezoelectric member (160) is joined to the first connector (120) and the ground connector (130) or to first and second connectors (120, 380) and the ground connector (130) via first and second electrode layers (140, 150; 240, 250) instead of using a complicated and laborious soldering operation, thereby enabling easy connection between the piezoelectric member and the connectors while preventing deterioration in performance caused by defective connection therebetween and deterioration in performance of the piezoelectric member caused by heat during manufacture.