Ultrasonic Probe Sound-Absorbing Layer for Wider Focal-Range Imaging
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Solution Overview
Problem
The single-row (1D) ultrasonic probe is limited by a fixed focal range due to its physical curvature, restricting high-resolution imaging to a narrow area, while multi-row probes face challenges in manufacturing and performance degradation.
Innovation Solution
The ultrasonic probe incorporates a sound absorbing layer with multiple piezoelectric bodies arranged in columns, connected via electrodes through ground, center, and side connection parts, allowing for easy assembly and reducing performance degradation by avoiding soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single-row (1D) probe with fixed curvature lens is used, then the structure is simple and manufacturing is easy, but the focal range is limited and high-resolution imaging is restricted to a narrow area
Solution Approach 1:
The probe array is divided into multiple rows (1.25D configuration with 3 rows) instead of a single row, allowing independent control of different focal regions. Each row can be focused at different depths, expanding the overall focal range while maintaining manufacturing simplicity through modular assembly
Solution Approach 2:
The probe incorporates adjustable focusing capability through electronic control of multiple rows, transforming the static fixed-focus limitation into a dynamic multi-focus system that can adapt to different imaging depths and requirements
2Manufacturing precision
If multi-row probe with complex electrode connections is used, then wider focal range and high-resolution imaging are achieved, but manufacturing difficulty increases and performance degradation occurs
Solution Approach 1:
A sound absorbing layer is introduced as an intermediary component between the piezoelectric elements and the back. This layer integrates multiple functions: acoustic impedance matching, electrical connection through conductive paste, and structural support, thereby simplifying the overall manufacturing process while maintaining high-resolution imaging capability across a wide focal range
Solution Approach 2:
The patent combines multiple functions into the sound absorbing layer: acoustic absorption, electrical conduction, and mechanical support. This merging reduces the number of separate components and assembly steps, making manufacturing easier while preserving the performance benefits of multi-row configuration
3Reliability
If traditional soldering connection method is used for piezoelectric bodies, then electrical connection is achieved, but performance degradation occurs due to complex assembly and potential damage to piezoelectric elements
Solution Approach 1:
The patent replaces the mechanical soldering process with a non-contact or low-stress electrical connection method using conductive paste applied to the sound absorbing layer. This substitution eliminates the risks associated with soldering (heat damage, mechanical stress) while maintaining reliable electrical connection, and greatly simplifies the assembly process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates high-resolution imaging over a wider area with improved manufacturing efficiency and reduced costs by simplifying electrode connections, enhancing the probe's performance and image quality.
Implementation Method 1
a plurality of piezoelectric bodies disposed in front of the sound absorbing layer
Implementation Method 2
a plurality of sound absorbing bodies configured to form a sound absorbing layer
Data Source
AI summary
An ultrasonic probe according to one embodiment comprises: a plurality of sound absorbing bodies that form a sound absorbing layer; at least one ground connection part that is joined between the sound absorbing bodies; at least one center connection part that is joined between the sound absorbing bodies and has an electrode; a plurality of side connection parts that are joined between the sound absorbing bodies and disposed outside the center connection part and have an electrode; and a plurality of piezoelectric bodies that are disposed in front of the sound absorbing layer to be electrically connected to the ground connection part, the center connection part, and the side connection parts.