Ultrasonic Probe Elevation Resolution via Synthetic Aperture
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Solution Overview
Problem
Existing ultrasonic imaging systems face a significant reduction in image resolution in the elevation direction due to mechanical scanning, which increases physical load and requires lower pixel density, and using a two-dimensionally arranged probe increases the electric circuit scale, making it costly and difficult to achieve high-resolution three-dimensional image data.
Innovation Solution
A measuring apparatus that employs a one-dimensionally arranged probe with a circuit for two-dimensional delay and sum processing, using first and second delay and sum circuits to improve image resolution in the elevation direction without increasing the circuit scale or compromising real-time processing, by performing delay and sum operations in both the arrangement and elevation directions using a synthetic aperture method.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a one-dimensionally arranged probe is used for mechanical scanning in the elevation direction, then the device complexity and cost are reduced, but the image resolution in the elevation direction significantly deteriorates
Solution Approach 1:
The patent applies synthetic aperture processing to effectively increase the aperture in the elevation direction by combining signals from multiple transmission and reception elements across different time points. This virtual aperture extension in the elevation dimension allows a one-dimensional probe array to achieve resolution comparable to what would require a physically larger two-dimensional array, thus resolving the contradiction between simple probe structure and high image resolution.
2Measurement precision
If the mechanical scan speed is decreased to reduce the pitch of obtaining cross-sectional slice images, then the image resolution in the elevation direction is improved, but the physical load to the human object increases
Solution Approach 1:
The patent replaces the reliance on slow mechanical scanning with electronic signal processing. By using synthetic aperture processing that combines ultrasonic signals from multiple elements and time points, the system achieves high elevation direction resolution without requiring slow mechanical movement, thus reducing physical load on the patient while maintaining image quality.
3Measurement precision
If a two-dimensionally arranged probe is used to improve image resolution in the elevation direction, then the measurement precision is improved, but the electric circuit scale increases making it costly and impractical
Solution Approach 1:
The patent creates a virtual two-dimensional aperture effect using a one-dimensional physical array by copying and combining signals from the same probe elements at different time points corresponding to different mechanical positions. This signal copying approach in the time domain replicates the functionality of a larger two-dimensional element array without requiring the corresponding increase in physical hardware and circuitry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves high-resolution, uniform three-dimensional ultrasonic wave image data at high speed with a simple and cost-effective design, enabling continuous mechanical scanning without impairing real-time image reconstruction.
Implementation Method 1
a probe in which a plurality of elements 11 for converting an acoustic wave into an electric signal are arranged
Implementation Method 2
obtains information inside an object using an acoustic wave
Data Source
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AI summary
Provided is a measuring apparatus, including: a moving mechanism for moving a probe (1) in an elevation direction; a first delay and sum circuit (9) for performing delay and sum of reception signals at individual positions along the elevation direction to output a first add signal (10); a signal extraction circuit (24) for letting an output of the first delay and sum circuit (9) to pass through delay circuits (23a, 23b) to output in parallel first add signals obtained at different positions; a second delay and sum circuit (27) for performing delay and sum of the first add signals output from the signal extraction circuit (24) to output a second add signal; and an image processing circuit (11,12,CPU) for generating image data by using the second add signal. Accordingly, image resolution in the elevation direction may be improved with a simple structure without deteriorating an image acquisition speed in the measuring apparatus for obtaining an ultrasonic image.