Ultrasonic Probe Flexible Substrate IC Mounting
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Solution Overview
Problem
Conventional ultrasonic measurement devices face challenges in downsizing due to the requirement of high voltage resistance driving ICs, which necessitate large mounting areas and increase the number of components, leading to increased cost and reduced channel density, thereby deteriorating ultrasonic beam convergence and resolution.
Innovation Solution
The ultrasonic measurement device incorporates a flexible substrate with signal electrode lines extending on the substrate, allowing for flip chip mounting of the integrated circuit device, reducing the mounting area, and using a piezoelectric element with a vibration film to operate with lower electric voltage, enabling compact and multi-channel designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a bulk piezoelectric member is used as an ultrasonic element, then high electric voltage resistance is required for driving, but this necessitates large mounting area for high voltage resistance ICs
Solution Approach 1:
The patent changes the operating voltage parameter from high voltage (bulk piezoelectric) to low voltage (thin film piezoelectric), eliminating the need for high voltage resistance ICs and their large mounting area
Solution Approach 2:
The patent replaces the bulk piezoelectric member with a thin film piezoelectric member, fundamentally changing the mechanical structure to enable low voltage operation and compact IC mounting
2Ease of operation
If high voltage resistance ICs are used to drive bulk piezoelectric members, then the driving function is achieved, but the number of ICs increases and device downsizing becomes difficult
Solution Approach 1:
Changing from high voltage to low voltage operation reduces IC complexity and quantity, as low voltage ICs are simpler and can be mounted in fewer numbers
Solution Approach 2:
The patent integrates the driving function into a compact configuration where the IC is mounted on a flexible substrate close to the ultrasonic element array, reducing the number of discrete components
3Area of stationary object
If the mounting area of ICs is reduced for downsizing, then device size decreases, but channel density reduces and ultrasonic beam convergence deteriorates
Solution Approach 1:
The patent mounts the IC on a flexible substrate in a direction intersecting with the signal line arrangement, utilizing spatial optimization to maintain channel density while reducing overall device footprint
Solution Approach 2:
The use of a flexible substrate allows the IC to be mounted in a compact configuration close to the ultrasonic element array, maintaining signal integrity and beam convergence while minimizing mounting area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables downsizing of the ultrasonic measurement device without compromising resolution, reduces the number of components, and allows for efficient signal transmission and reception, achieving symmetrical ultrasonic beam formation with reduced wiring resistance.
Implementation Method 1
a bulk piezoelectric member has been used as an ultrasonic element which transmits and receives ultrasonic waves
Implementation Method 2
an ultrasonic element array having a plurality of ultrasonic elements arranged on the substrate
Data Source
AI summary
An ultrasonic measurement device includes an ultrasonic transducer device, a flexible substrate and an integrated circuit device. The ultrasonic transducer device has a substrate, an ultrasonic element array, a plurality of signal electrode lines formed on the substrate and electrically connected to the ultrasonic element array, and a plurality of signal terminals arranged on the substrate. In the flexible substrate, a plurality of signal lines are formed along a first direction. Each of the signal electrode lines has an electrode layer in which at least one signal electrode among some of the ultrasonic elements extends on the substrate. A long side direction of the integrated circuit device extends along a second direction which intersects with the first direction, and each of terminals of the integrated circuit device is connected to a corresponding one of the signal lines of the flexible substrate.