Ultrasonic Probe Folded Circuit Layer Wire Distribution
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Ultrasonic probes with multi-row configurations face issues of electrical disconnection due to folding of wires corresponding to piezoelectric elements on laminate circuit structures, which can lead to disruptions in the circuit pattern on flexible printed circuit boards.
Innovation Solution
The ultrasonic probe design includes piezoelectric elements arranged in rows and columns with a second circuit layer having a first region in contact with the piezoelectric elements and a second region at opposite ends that is folded without contact, where wires from one row extend to the adjacent row, and a convergence layer gathers wires as a single layer, preventing disconnection by distributing them in a way that maintains electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a multi-row probe configuration is implemented using a laminate circuit structure on an FPCB, then high-resolution imaging in a wider area is achieved, but circuit disconnection occurs when the laminate circuit structure is folded
Solution Approach 1:
The circuit board is divided into a first circuit board and a second circuit board that can be folded relative to each other. The piezoelectric element array is segmented across these two boards, with odd-numbered rows on the first board and even-numbered rows on the second board. This segmentation allows the circuit structure to accommodate folding without disconnection while maintaining the multi-row probe configuration for high-resolution imaging.
Solution Approach 2:
A folding section acts as an intermediary between the first and second circuit boards, providing a flexible connection that maintains electrical continuity during folding. The wire connections are routed through this folding section, which serves as a mediator to prevent circuit disconnection while allowing the necessary mechanical movement for probe flexibility.
2Adaptability or versatility
If wires are folded to accommodate the multi-row probe structure, then adaptability of the probe is improved, but wire disconnection and circuit pattern disruption occur
Solution Approach 1:
The circuit board structure is made dynamic through the folding section, which allows relative movement between the first and second circuit boards. This dynamic design enables the probe to adapt to different imaging conditions while maintaining wire connections through the folding section, preventing disconnection during flexing or positioning adjustments.
3Ease of operation
If the laminate circuit structure is folded to achieve probe flexibility, then ease of operation is improved, but manufacturing complexity increases due to the need to prevent wire disconnection
Solution Approach 1:
By segmenting the circuit board into foldable sections and distributing piezoelectric elements across multiple rows on different boards, the design achieves flexibility while managing complexity through modular construction. The wiring pattern is systematically arranged to follow the folding geometry, making the complex structure more manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents wire disconnection and enhances the pitch design of transducer elements, ensuring stable and efficient ultrasonic imaging by maintaining electrical connectivity even when the circuit layers are folded.
Implementation Method 1
piezoelectric elements forming a plurality of rows arranged to form a pair along a lateral direction
Implementation Method 2
receive a signal reflected from the object
Data Source
AI summary
Disclosed in an ultrasonic probe for obtaining an ultrasonic image. The ultrasonic probe includes piezoelectric elements forming a plurality of rows arranged to form a pair along a lateral direction, a kerf formed between the piezoelectric elements along the lateral direction, a first circuit layer disposed below the piezoelectric elements, a second circuit layer disposed to be spaced apart from a lower side of the first circuit layer and including a plurality of wires extending along the rows, the second circuit layer being provided with a first region in selectively contact with the piezoelectric elements and a second region disposed at opposite ends of the first region and folded without being in contact with the piezoelectric elements, and a first connection part to electrically connect the first circuit layer and the second circuit layer, wherein the first region is, when the plurality of wires extending along one row of the pair of rows extends from the first region to the second region, provided such that the plurality of wires is distributed to the other adjacent row.