Ultrasonic Probe Mounting Structure for Low-Precision Substrate Alignment
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Solution Overview
Problem
Existing mounting methods for electric components on circuit substrates face challenges in achieving accurate alignment and preventing interference between bump electrodes and functional elements, especially when wiring connections are performed in regions with functional elements.
Innovation Solution
A mounting structure is designed with a first substrate having a functional element and a wiring portion connected to it, and a second substrate with a conduction portion that is connected to the wiring portion and the functional element. The conduction portion is positioned such that the shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and the connection point of the wiring portion and the conduction portion, allowing for easier alignment and connection without interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wiring connection is performed in the region where functional element is formed, then electrical connection between substrates is achieved, but alignment accuracy must be very high to prevent interference between bump electrode and functional element
Solution Approach 1:
The patent divides the substrate into distinct functional regions: a functional element formation region and a wiring connection region. The bump electrodes are positioned in the wiring connection region, which is separated from the functional element region, allowing independent optimization of each area without interference
Solution Approach 2:
The wiring connection function is extracted from the functional element region and placed in a separate wiring connection region. This extraction allows the bump electrodes to be positioned away from functional elements, eliminating the need for high alignment accuracy while maintaining reliable electrical connection
2Ease of manufacture
If bump electrode is positioned at peripheral edge portion of substrate, then wiring connection is simplified, but electrical connection cannot be performed in the region where functional element is formed
Solution Approach 1:
The patent utilizes the planar dimension of the substrate by creating a separate wiring connection region that is spatially distinct from the functional element region. This dimensional separation allows bump electrodes to access functional elements through a dedicated wiring area rather than being constrained to peripheral positions only
3Reliability
If alignment accuracy is not sufficient, then bump electrode may interfere with functional element, but achieving high alignment accuracy increases manufacturing complexity
Solution Approach 1:
The patent preemptively prevents potential interference between bump electrodes and functional elements by designing the bump electrodes to be positioned in a wiring connection region that is separated from the functional element region. This preliminary spatial arrangement eliminates the risk of interference before manufacturing occurs, removing the need for complex high-precision alignment processes
Data Source
AI summary
A mounting structure includes: a first substrate that has a first surface on which a functional element is provided; a wiring portion that is provided at a position, which is different from a position of the functional element on the first surface, and is conductively connected to the functional element; a second substrate that has a second surface that is opposite to the first surface; and a conduction portion that is provided on the second surface, is connected to the wiring portion, and is conductively connected the functional element. The shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and a position where the wiring portion is connected to the conduction portion.