Ultrasonic Probe Mounting Structure With Protruding Conduction Portion
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Solution Overview
Problem
Existing mounting configurations for electronic components on circuit substrates face challenges in achieving high-density integration due to increased wiring resistance and parasitic capacitance, with reduced electrode terminal sizes leading to reliability concerns and positional deviations during connection.
Innovation Solution
A mounting structure with a wiring portion and conduction portion where the conduction portion's surface area is larger than the wiring portion's end section, allowing for increased positional deviation tolerance and improved connection reliability, while maintaining high-density integration by reducing the electrode terminal size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the electrode terminal size is reduced to achieve high-density integration, then the integration density is improved, but the positioning accuracy between substrates deteriorates
Solution Approach 1:
The invention transitions the connection interface from a two-dimensional planar contact to a three-dimensional protruding structure. The conduction portion protrudes from the second substrate toward the first substrate, creating a vertical dimension that increases the effective contact area while maintaining a compact footprint. This dimensional change allows the connection interface to accommodate positioning deviations without compromising integration density.
Solution Approach 2:
The connection structure is divided into distinct functional segments: the wiring portion on the first substrate and the conduction portion on the second substrate. This segmentation allows each part to be optimized independently - the wiring portion can be minimized for high-density integration while the conduction portion can be enlarged to provide positioning tolerance, resolving the contradiction between density and precision.
2Reliability
If the conduction portion area is increased to improve positioning tolerance, then the connection reliability is improved, but the device area increases
Solution Approach 1:
The conduction portion utilizes the vertical dimension by protruding from the second substrate toward the first substrate. This creates an overlapping three-dimensional connection region that increases the effective contact area without proportionally increasing the planar footprint. The connection reliability is enhanced through the enlarged conduction portion area while the device maintains compact dimensions.
3Quantity of substance
If wiring is connected in the region where functional element is formed to achieve high-density integration, then the integration density is improved, but the positioning accuracy requirement increases
Solution Approach 1:
The conduction portion is pre-formed on the second substrate with a larger area than the wiring portion end section. This preliminary preparation creates a positioning tolerance buffer before the actual connection is made. The overlapping area design anticipates potential positioning deviations, allowing the wiring and conduction portions to connect reliably even with moderate positioning accuracy.
Data Source
AI summary
A mounting structure includes a first substrate which has a first surface on which a functional element is provided, a second substrate that has a second surface facing the first surface, a wiring portion that is provided at a position which is different from a position of the functional element on the first surface, has a third surface facing the second surface, and is electrically connected to the functional element, and a conduction portion that is provided on the second surface, protrudes toward the first surface, and is connected to the third surface so as to be electrically connected to the functional element, in which an area of the third surface is larger than an area of a first end section of the wiring portion on the first substrate side in a plan view which is viewed from a thickness direction of the first substrate and the second substrate.