Ultrasonic Probe Noise Shielding via Conductive Films
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Solution Overview
Problem
Ultrasonic probes face interference from electromagnetic noise, which affects the accuracy of ultrasonic imaging due to the lack of effective noise shielding on all sides of the ultrasonic element arrays.
Innovation Solution
The ultrasonic apparatus incorporates a conductive film on one side and a conductive casing portion surrounding the ultrasonic element array, along with a conductive support substrate on the opposite side, to absorb and block electromagnetic noise from all directions, enhancing noise shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conductive films are provided only on one side and orthogonal sides of the ultrasonic element array, then electromagnetic noise from those directions is blocked, but electromagnetic noise from the opposite side cannot be prevented
Solution Approach 1:
The noise shielding structure is divided into multiple segments: a first conductive film on the first direction side, a second conductive film on the opposite side, and conductive films on orthogonal sides. Each segment shields against electromagnetic noise from its specific direction, collectively providing comprehensive protection against noise from all directions.
2Ease of manufacture
If the ultrasonic elements are connected via long wires, then the ultrasonic element array can be formed, but the wires easily receive electromagnetic noise
Solution Approach 1:
Conductive films are provided on all sides of the ultrasonic element array before the array is connected to the main body. These conductive films create a preliminary shield that blocks electromagnetic noise from reaching the long wires and ultrasonic elements, preventing noise interference before it can affect the system operation.
3Reliability
If conductive shielding is added to all sides of the ultrasonic element array, then electromagnetic noise from all directions is blocked, but the device complexity increases
Solution Approach 1:
The conductive films on each side of the ultrasonic element array serve multiple functions: they block electromagnetic noise from their respective directions, and when connected to each other, they form a continuous shield that provides comprehensive protection. This multi-functional design achieves complete noise shielding without requiring separate components for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces electromagnetic noise interference, improving the accuracy of ultrasonic imaging by ensuring that the ultrasonic element arrays receive minimal noise, thus enhancing the overall performance of the ultrasonic apparatus.
Implementation Method 1
a first conductive film provided on a first direction side of the ultrasonic element array; Electromagnetic noise directed toward the ultrasonic element array from the first direction side is reflected and blocked or is absorbed and attenuated by the first conductive film
Implementation Method 2
a casing portion that has a conductive member provided to surround the ultrasonic element substrate on a side intersecting the first direction of the ultrasonic element substrate; electromagnetic noise directed toward the ultrasonic element array from the direction side intersecting the first direction is reflected and blocked or is absorbed and attenuated by the conductive member
Implementation Method 3
a support substrate that is provided on an opposite side to the first direction of the ultrasonic element substrate, supports the ultrasonic element substrate, and has conductivity; electromagnetic noise which is directed toward the ultrasonic element array from the opposite direction side to the first direction is reflected and blocked or is absorbed and attenuated by the support substrate
Data Source
AI summary
An ultrasonic apparatus includes an ultrasonic element substrate that includes an ultrasonic element array transmitting an ultrasonic wave in a first direction, and a first conductive film provided on the first direction side of the ultrasonic element array, a casing portion that has a conductive member provided to surround the ultrasonic element substrate on a side intersecting the first direction of the ultrasonic element substrate, and a support substrate that is provided on an opposite side to the first direction of the ultrasonic element substrate, supports the ultrasonic element substrate, and has conductivity.