Ultrasonic Probe Surface Temperature Estimation via Relay Board Sensors
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Solution Overview
Problem
Existing ultrasonic diagnostic devices face challenges in accurately controlling the surface temperature of the ultrasonic-wave transmission/reception surface without compromising image quality, as traditional temperature sensors on the surface cause noise and have limited thermal responsiveness.
Innovation Solution
An ultrasonic diagnostic device with a temperature sensing unit disposed within the wave transceiver unit, estimating the surface temperature based on wave transmission/reception conditions and power consumption, using multiple temperature sensors on a relay board to enhance accuracy and responsiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature sensor is disposed on the wave transmission/reception surface, then the surface temperature can be directly measured, but noise is introduced in transmitted and received waves causing deterioration of ultrasonic wave images
Solution Approach 1:
The patent introduces an intermediary approach by placing temperature sensors not directly on the wave transmission/reception surface but in proximity to the oscillator and electronic circuit. The system uses thermal conduction through the housing to indirectly measure surface temperature, thereby avoiding direct contact between sensors and the acoustic path. This intermediary measurement method eliminates noise interference while still providing accurate surface temperature data through thermal correlation.
2Speed
If a temperature sensor is disposed near the oscillator, then thermal responsiveness is improved, but the temperature of the wave transmission/reception surface cannot be directly sensed
Solution Approach 1:
The system implements a feedback mechanism where temperature sensors near the oscillator continuously monitor thermal conditions, and the processor uses this feedback to estimate the wave transmission/reception surface temperature. By correlating the temperature data from multiple sensor locations with the known thermal conduction characteristics of the housing, the system achieves both rapid thermal responsiveness and accurate surface temperature estimation without direct surface contact.
Solution Approach 2:
The patent replaces direct mechanical contact measurement (sensors on the surface) with an indirect thermal field measurement approach. Temperature sensors are positioned near heat-generating components, and the system substitutes direct surface temperature sensing with computational estimation based on thermal conduction models, achieving both speed and accuracy through this substitution.
3Measurement precision
If multiple temperature sensors are disposed on the relay board, then temperature estimation accuracy is improved, but device complexity increases
Solution Approach 1:
The patent applies local quality by strategically positioning temperature sensors at specific locations on the relay board where they can most effectively monitor thermal conditions. Rather than uniformly distributing sensors, the system places them near critical heat-generating components such as the oscillator and electronic circuit, optimizing measurement precision in key thermal zones while minimizing the total number of sensors required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Accurate estimation and real-time control of the surface temperature, preventing overheating and maintaining image quality by considering power consumption from both the oscillator and electronic circuit, with improved thermal responsiveness and positioning of temperature sensors.
Implementation Method 1
a temperature sensor is disposed in the wave transceiver unit... estimates a surface temperature of the wave transmission/reception surface based on a wave transmission/reception condition of the ultrasonic waves, and a sensed value sensed by the temperature sensor
Data Source
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Figure 3A~3C
AI summary
In the present invention, a wave transmission/reception unit is provided in the distal end of a probe. The wave transmission/reception unit includes a 2D-array oscillator, an electronic circuit, and a relay substrate for electrically joining the 2D-array oscillator and the electronic circuit. The face of the wave transmission/reception unit on a subject side thereof is a wave transmission/reception face. A temperature detection unit is provided to the relay substrate. In the present invention, a surface temperature estimation unit estimates the temperature of the surface of the wave transmission/reception face on the basis of the detected temperature from the temperature detection unit and the power consumption by the wave transmission/reception unit. Specifically, by separately taking into account the power consumption of the electronic circuit and the power consumption of the 2D-array oscillator, the temperature difference from a temperature detection location to the surface of the wave transmission/reception face is estimated, and the surface temperature is estimated from the detected temperature and the temperature difference.