Ultrasonic Probe Mounting Structure for Tolerant Substrate Wiring
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Solution Overview
Problem
Existing mounting methods for electric components on circuit substrates face challenges in accurately aligning and connecting wiring between substrates, especially when the functional elements are present, leading to potential interference and unreliable connections.
Innovation Solution
A mounting structure is designed with a first substrate having a functional element and a wiring portion connected to it, and a second substrate with a conduction portion that is connected to the wiring portion. The conduction portion is positioned such that the shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and the connection point of the wiring portion, allowing for easier alignment and reduced interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wiring connection is performed in the region where functional elements are formed, then electrical connection between substrates is achieved, but alignment accuracy must be very high to avoid interference with functional elements
Solution Approach 1:
The substrate surface is divided into two distinct regions: a functional element formation region and a wiring connection region. The wiring portion and conduction portion are specifically positioned in the wiring connection region, which is separated from the functional element region. This spatial segmentation allows bump electrodes to connect wirings without interfering with functional elements, thereby maintaining electrical connection reliability while reducing alignment accuracy requirements.
Solution Approach 2:
The wiring connection function is extracted from the functional element region and relocated to a separate wiring connection region. By providing dedicated wiring portions on the first substrate and conduction portions on the second substrate in this separate region, the patent enables bump electrodes to form connections without the presence of functional elements, thus solving the alignment accuracy problem while maintaining reliable electrical connection.
2Ease of manufacture
If bump electrode is positioned at peripheral edge portion of substrate, then wiring connection is simplified, but connection position is separated from functional element
Solution Approach 1:
The patent transitions from traditional peripheral edge connection to a planar region-based connection approach. Instead of connecting at the substrate periphery, the wiring connection region is defined as a specific area on the substrate surface that is spatially separated from functional elements. This dimensional reorganization allows bump electrodes to be positioned in a dedicated region, simplifying the connection process while providing sufficient alignment tolerance through the separated spatial arrangement.
Data Source
AI summary
A mounting structure includes: a first substrate that has a first surface on which a functional element is provided; a wiring portion that is provided at a position, which is different from a position of the functional element on the first surface, and is conductively connected to the functional element; a second substrate that has a second surface that is opposite to the first surface; and a conduction portion that is provided on the second surface, is connected to the wiring portion, and is conductively connected the functional element. The shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and a position where the wiring portion is connected to the conduction portion.