Ultrasonic Device Recessed Wall Isolation
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Solution Overview
Problem
Ultrasonic devices for diagnostic apparatuses face challenges in achieving high accuracy in frequency and sensitivity while minimizing crosstalk, which is often compromised by variations in groove size, depth, and position near fixed ends of vibration films.
Innovation Solution
The ultrasonic device incorporates a substrate with recesses in the wall portions between vibration films, preventing vibration propagation and maintaining stiffness, along with separate interconnects for each piezoelectric element to reduce crosstalk and enhance signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If grooves are formed near fixed ends of vibration films to increase displacement, then amplitude is improved, but manufacturing precision deteriorates due to variations in groove size, depth, and position affecting frequency and sensitivity
Solution Approach 1:
The invention extracts the problematic grooves from the vibration films and relocates them to the wall portions. This separation removes the source of manufacturing variability from the critical vibration film structure, eliminating the trade-off between amplitude enhancement and manufacturing precision.
Solution Approach 2:
The wall portions serve as intermediary structures that carry the grooves instead of the vibration films. This intermediary approach allows the grooves to fulfill their amplitude-enhancing function while isolating the vibration films from manufacturing variations, thereby maintaining frequency and sensitivity accuracy.
2Object-generated harmful factors
If grooves are formed to reduce crosstalk, then isolation between elements is improved, but manufacturing complexity increases due to precise control requirements
Solution Approach 1:
The crosstalk-reducing grooves are extracted from the vibration films and placed in the wall portions. This relocation simplifies the manufacturing process by separating the crosstalk mitigation function from the sensitive vibration film structure, reducing the precision requirements and overall manufacturing complexity.
3Object-generated harmful factors
If recesses are formed in wall portions to suppress vibration propagation, then crosstalk is reduced, but structural integrity may be compromised
Solution Approach 1:
The recesses are formed locally in the wall portions rather than throughout the entire substrate. This localized approach provides sufficient vibration isolation to reduce crosstalk while preserving the overall structural integrity of the substrate, as the recesses are confined to non-critical support regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves high accuracy in frequency and sensitivity while minimizing crosstalk, maintaining vibration characteristics and stiffness, and allows for efficient signal enhancement on a channel-by-channel basis.
Implementation Method 1
a first piezoelectric element and a second piezoelectric element that are provided on the first vibration film and the second vibration film, respectively
Implementation Method 2
vibration propagating through the first wall portion is reflected by the space in the first recess
Data Source
AI summary
An ultrasonic device that has high accuracy with respect to frequency and sensitivity and that can achieve a reduction of crosstalk is provided. A substrate of an ultrasonic device has a first surface and a second surface on a side opposite to the first surface, and has a first opening and a second opening that are separated from each other by a wall portion. A first vibration film and a second vibration film that close the first opening and the second opening, respectively, are disposed on the first surface of the substrate. A first piezoelectric element and a second piezoelectric element are provided on the first vibration film and the second vibration film, respectively. A recess that opens in the second surface of the substrate is demarcated in the wall portion.